MC10H161PG

MC10H161
http://onsemi.com
4
ORDERING INFORMATION
Device Package Shipping
MC10H161FN PLLC20 46 Units / Rail
MC10H161FNG PLLC20
(PbFree)
46 Units / Rail
MC10H161FNR2 PLLC20 500 / Tape & Reel
MC10H161FNR2G PLLC20
(PbFree)
500 / Tape & Reel
MC10H161L CDIP16 25 Unit / Rail
MC10H161M SOEIAJ16 50 Unit / Rail
MC10H161MG SOEIAJ16
(PbFree)
50 Unit / Rail
MC10H161MEL SOEIAJ16 2000 / Tape & Reel
MC10H161MELG SOEIAJ16
(PbFree)
2000 / Tape & Reel
MC10H161P PDIP16 25 Unit / Rail
MC10H161PG PDIP16
(PbFree)
25 Unit / Rail
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MC10H161
http://onsemi.com
5
PACKAGE DIMENSIONS
M
N
L
Y BRK
W
V
D
D
S
L−M
M
0.007 (0.180) N
S
T
S
L−M
M
0.007 (0.180) N
S
T
S
L−M
S
0.010 (0.250) N
S
T
X
G1
B
U
Z
VIEW DD
20 1
S
L−M
M
0.007 (0.180) N
S
T
S
L−M
M
0.007 (0.180) N
S
T
S
L−M
S
0.010 (0.250) N
S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
T
SEATING
PLANE
S
L−M
M
0.007 (0.180) N
S
T
S
L−M
M
0.007 (0.180) N
S
T
H
VIEW S
K
K1
F
G1
20 LEAD PLLC
CASE 77502
ISSUE E
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS L, M, AND N DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM T, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 −−− 0.51 −−−
K 0.025 −−− 0.64 −−−
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y −−− 0.020 −−− 0.50
Z 2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 −−− 1.02 −−−
____
MC10H161
http://onsemi.com
6
PACKAGE DIMENSIONS
SOEIAJ16
CASE 96601
ISSUE A
H
E
A
1
DIM MIN MAX MIN MAX
INCHES
−−− 2.05 −−− 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.10 0.20 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
−−− 0.78 −−− 0.031
A
1
H
E
Q
1
L
E
_
10
_
0
_
10
_
L
E
Q
1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005)
0.10 (0.004)
1
16 9
8
D
Z
E
A
b
c
D
E
e
L
M
Z
CDIP16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
5 THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620−10.
F
E
N
K
C
SEATING
PLANE
A
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C −−− 0.200 −−− 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L 0.300 BSC 7.62 BSC
M 0 15 0 15
N 0.020 0.040 0.51 1.01
____
A
B
A
B
16
1
9
8
G
16X D
B
M
0.25 (0.010) T
T
16X J

MC10H161PG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC DECODER BIN 1:8 16-DIP
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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