VLWTG9900
www.vishay.com
Vishay Semiconductors
Rev. 1.6, 07-Oct-15
1
Document Number: 81259
For technical questions, contact: LED@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TELUX LED
DESCRIPTION
The VLWTG9900 is a clear, non diffused LED for
applications where high luminous flux is required.
It is designed in an industry standard 7.62 mm square
package utilizing highly developed InGaN technology.
The supreme heat dissipation of VLWTG9900 allows
applications at high ambient temperatures.
All packing units are binned for luminous flux, forward
voltage, and color to achieve the most homogenous light
appearance in application.
PRODUCT GROUP AND PACKAGE DATA
• Product group: LED
• Package: TELUX
• Product series: power
• Angle of half intensity: ± 45°
FEATURES
• High luminous flux
• Supreme heat dissipation: R
thJP
is 90 K/W
• High operating temperature:
T
amb
= -40 °C to +100 °C
• Packed in tubes for automatic insertion
• Luminous flux and color categorized for each
tube
• Small mechanical tolerances allow precise
usage of external reflectors or light guides
• Compatible with wave solder processes
according to CECC 00802
• ESD-withstand voltage: up to 1 kV according to
JESD 22-A114-B
• AEC-Q101 qualified
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Exterior lighting
• Replacement of small incandescent lamps
• Traffic signals and signs
Note
(1)
Driving the LED in reverse direction is suitable for a short term application
PARTS TABLE
PART COLOR
LUMINOUS FLUX
(mlm)
at I
F
(mA)
WAVELENGTH
(nm)
at I
F
(mA)
FORWARD VOLTAGE
(V)
at I
F
(mA)
TECHNOLOGY
MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.
VLWTG9900 True green 2000 4000 - 50 509 520 535 50 - 3.9 4.7 50 InGaN on SiC
ABSOLUTE MAXIMUM RATINGS (T
amb
= 25 °C, unless otherwise specified)
VLWTG9900
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage
(1)
I
R
= 10 μA V
R
5V
DC forward current T
amb
≤ 50 °C I
F
50 mA
Surge forward current t
p
≤ 10 μs I
FSM
0.1 A
Power dissipation P
V
230 mW
Junction temperature T
j
100 °C
Operating temperature range T
amb
-40 to +110 °C
Storage temperature range T
stg
-55 to +110 °C
Soldering temperature
t ≤ 5 s, 1.5 mm from body preheat
temperature 100 °C / 30 s
T
sd
260 °C
Thermal resistance junction / ambient With cathode heatsink of 70 mm
2
R
thJA
200 K/W
Thermal resistance junction / pin R
thJP
90 K/W