VS-HFA04SD60SL-M3

VS-HFA04SD60S-M3
www.vishay.com
Vishay Semiconductors
Revision: 24-Nov-16
1
Document Number: 93473
For technical questions within your region: DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
HEXFRED
®
,
Ultrafast Soft Recovery Diode, 4 A
FEATURES
Ultrafast recovery time
Ultrasoft recovery
Very low I
RRM
Very low Q
rr
Guaranteed avalanche
Specified at operating temperature
Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
BENEFITS
Reduced RFI and EMI
Reduced power loss in diode and switching transistor
Higher frequency operation
Reduced snubbing
Reduced parts count
DESCRIPTION / APPLICATIONS
These diodes are optimized to reduce losses and EMI / RFI
in high frequency power conditioning systems. The softness
of the recovery eliminates the need for a snubber in
most applications. These devices are ideally suited for
freewheeling, flyback, power converters, motor drives, and
other applications where high speed and reduced switching
losses are design requirements.
PRODUCT SUMMARY
Package TO-252AA (D-PAK)
I
F(AV)
4 A
V
R
600 V
V
F
at I
F
1.4 V
t
rr
typ. 17 ns
T
J
max. 150 °C
Diode variation Single die
Anode
1
3
2, 4
N/C
D-PAK (TO-252AA)
TO-252AA (D-PAK)
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Cathode to anode voltage V
RRM
600 V
Maximum continuous forward current I
F(AV)
T
C
= 100 °C 4
ASingle pulse forward current I
FSM
25
Repetitive peak forward current I
FRM
T
C
= 116 °C 16
Maximum power dissipation P
D
T
C
= 100 °C 10 W
Operating junction and storage temperatures T
J
, T
Stg
-55 to +150 °C
ELECTRICAL SPECIFICATIONS (T
J
= 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Breakdown voltage,
blocking voltage
V
BR
,
V
R
I
R
= 100 μA 600 - -
V
Forward voltage
See fig. 1
V
F
I
F
= 4 A - 1.5 1.8
I
F
= 8 A - 1.8 2.2
I
F
= 4 A, T
J
= 125 °C - 1.4 1.7
Maximum reverse
leakage current
I
R
V
R
= V
R
rated - 0.17 3.0
μA
T
J
= 125 °C, V
R
= 0.8 x V
R
rated - 44 300
Junction capacitance C
T
V
R
= 200 V - 4 8 pF
Series inductance L
S
Measured lead to lead 5 mm from package body - 8.0 - nH
VS-HFA04SD60S-M3
www.vishay.com
Vishay Semiconductors
Revision: 24-Nov-16
2
Document Number: 93473
For technical questions within your region: DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DYNAMIC RECOVERY CHARACTERISTICS (T
C
= 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Reverse recovery time t
rr
I
F
= 1.0 A, dI
F
/dt = 200 A/μA, V
R
= 30 V - 17 -
nsT
J
= 25 °C
I
F
= 4 A
dI
F
/dt = 200 A/μs
V
R
= 200 V
-2842
T
J
= 125 °C - 38 57
Peak recovery current I
RRM
T
J
= 25 °C - 2.9 5.2
A
T
J
= 125 °C - 3.7 6.7
Reverse recovery charge Q
rr
T
J
= 25 °C - 40 60
nC
T
J
= 125 °C - 70 105
Rate of fall of recovery current dI
(rec)M
/dt
T
J
= 25 °C - 280 -
A/μs
T
J
= 125 °C - 235 -
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Maximum junction and
storage temperature range
T
J
, T
Stg
-55 - 150 °C
Thermal resistance,
junction to case
R
thJC
--5.0
°C/W
Thermal resistance,
junction to ambient
R
thJA
Typical socket mount - - 80
Weight
-2.0- g
-0.07- oz.
Mounting torque
6.0
(5.0)
-
12
(10)
kgf · cm
(lbf in)
Marking device Case style TO-252AA (D-PAK) HFA04SD60S
VS-HFA04SD60S-M3
www.vishay.com
Vishay Semiconductors
Revision: 24-Nov-16
3
Document Number: 93473
For technical questions within your region: DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 1 - Typical Forward Voltage Drop Characteristics Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
Fig. 4 - Maximum Thermal Impedance Z
thJC
Characteristics
1
10
T
J
= 175 °C
T
J
= 125 °C
T
J
= 25 °C
0 62 3
V
F
- Forward Voltage Drop (V)
I
F
- Instantaneous Forward Current (A)
100
14
0.1
5
0.01
0.1
1
10
100
0 100 200
V
R
- Reverse Voltage (V)
I
R
- Reverse Current (µA)
T
J
= 150 °C
T
J
= 125 °C
T
J
= 25 °C
0.001
1000
300 500
400
10
100
1 10 100 1000
1
V
R
- Reverse Voltage (V)
C
T
- Junction Capacitance (pF)
T
J
= 25 °C
0.01
0.1
10
0.00001 0.0001 0.001 0.01 0.1
t
1
- Rectangular Pulse Duration (s)
Z
thJC
- Thermal Impedance (°C/W)
1
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
Single pulse
(thermal resistance)
P
DM
t
2
t
1
Notes:
1. Duty factor D = t
1
/t
2
2. Peak T
J
= P
DM
x Z
thJC
+ T
C

VS-HFA04SD60SL-M3

Mfr. #:
Manufacturer:
Vishay Semiconductors
Description:
Diodes - General Purpose, Power, Switching Hexfreds - D-PAK-e3
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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