DS1743/DS1743P Y2K-Compliant, Nonvolatile Timekeeping RAMs
13 of 16
POWER-UP/DOWN CHARACTERISTICS—5V
(V
CC
= 5.0V 10%, T
A
= Over the Operating Range.)
PARAMETER SYMBOL MIN TYP MAX UNITS NOTES
CE or WE at V
IH
, CE2 at V
IL
, Before
Power-Down
t
PD
0
s
V
CC
Fall Time: V
PF(MAX)
to V
PF(MIN)
t
F
300
s
V
CC
Fall Time: V
PF(MIN)
to V
SO
t
FB
10
s
V
CC
Rise Time: V
PF(MIN)
to V
PF(MAX)
t
R
0
s
Power-Up Recover Time t
REC
35 ms
Expected Data-Retention Time
(Oscillator On)
t
DR
10 years 6, 7
POWER-UP/DOWN TIMING (5V DEVICE)
DS1743/DS1743P Y2K-Compliant, Nonvolatile Timekeeping RAMs
14 of 16
POWER-UP/DOWN CHARACTERISTICS—3.3V
(V
CC
= 3.3V 10%, T
A
= Over the Operating Range.)
PARAMETER SYMBOL MIN TYP MAX UNITS NOTES
CE or WE at V
IH
, Before
Power-Down
t
PD
0
s
V
CC
Fall Time: V
PF(MAX)
to V
PF(MIN)
t
F
300
s
V
CC
Rise Time: V
PF(MIN)
to V
PF(MAX)
t
R
0
s
V
PF
to RST High
t
REC
35 ms
Expected Data-Retention Time
(Oscillator On)
t
DR
10 years 6, 7
POWER-UP/DOWN WAVEFORM TIMING (3.3V DEVICE)
CAPACITANCE
(T
A
= +25C)
PARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Capacitance on All Input Pins C
IN
7 pF
Capacitance on All Output Pins C
O
10 pF
DS1743/DS1743P Y2K-Compliant, Nonvolatile Timekeeping RAMs
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AC TEST CONDITIONS
Output Load: 50 pF + 1TTL Gate
Input Pulse Levels: 0 to 3.0V
Timing Measurement Reference Levels:
Input: 1.5V
Output: 1.5V
Input Pulse Rise and Fall Times: 5ns
NOTES:
1) Voltages are referenced to ground.
2) Typical values are at +25C and nominal supplies.
3) Outputs are open.
4) Battery switchover occurs at the lower of either the battery terminal voltage or V
PF
.
5) The CE2 control signal functions the same as the CE signal except that the logic levels for active and
inactive levels are opposite. If CE2 is used to terminate a write, the CE2 data hold time (t
DH
) applies.
6) Data-retention time is at +25C.
7) Each DS1743 has a built-in switch that disconnects the lithium source until V
CC
is first applied by the
user. The expected tDR is defined for DIP modules as a cumulative time in the absence of V
CC
starting
from the time power is first applied by the user.
8) RTC Encapsulated DIP Modules (EDIP) can be successfully processed through conventional wave-
soldering techniques as long as temperatures as long as temperature exposure to the lithium energy
source contained within does not exceed +85C. Post-solder cleaning with water-washing techniques is
acceptable, provided that ultrasonic vibration is not used. See the PowerCap package drawing for
details regarding the PowerCap package.

DS1743W-150+

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
IC RTC CLK/CALENDAR PAR 28-EDIP
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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