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TGH600 Series
600 Watt Thick Film SOT227 Package
CHARACTERISTICS
(continued)
Ohmic range
0.25 to 1K
Resistance tolerance
±10%; ±5% on request
Temperature coefficient
±250ppm/°C (others on request)
Maximum working voltage
500V DC (higher voltage on request)
Power rating
600W at 85°C bottom case temperature. Note:
Liquid cooling required to achieve full power rating.
Electric strength voltage
Dielectric strength up to 4,000VDC against ground
Isolation voltage
between R1 and R2: 500V; 1,000V on request
Partial discharge
2kVrms, <80pC
Insulation resistance
10GΩ min. at 1kV
Short time overload
1.25 x rated power at 85°C bottom case temp. for
10 sec, ΔR = 0.4% max.
Operating temperature
-55°C to +155°C
Due to the TGH600's non-inductive design, they
are deally suited for high-frequency and pulse-
load applications. The TGH600 series resistors are
designed for direct mounting onto a heatsink and
provides up to 600 watts of power dissipation.
Popular applications include variable speed drives,
power supplies, control devices, telecom, robotics,
motor controls, and other switching designs.
PERFORMANCE DATA
Test Method ΔR
Moisture Resistance
MIL-Std-202, Method 106 (0.5% + 0.001W) max
Thermal shock
Mil-Std-202, Method 107, Cond F (0.3% + 0.01W) max
Terminal Strength
MIL-Std-202, Method 211, Cond A (pull test) 2.4N (0.2% = 0.01W) max
Vibration, High Frequency
MIL-Std-202, Method 204, Cond D (0.2% + 0.01W) max
Life
20 years (120,000 hours) Operating failure rate of 8.3 x 10-7 fail/hour.
Requirements to be achieved under the following conditions: T
amb=25°C, THS=70°C, Papplied=Pn
100
Percent Rated Power
Bottom of base plate Temperature, °C
60
20
0
175
80
40
25 100 125050 85
600
Rated Power, W
360
120
0
480
240
150
Derating
Derating (thermal resistance): 8.33 W/K (0.12 K/W)
(for conf. 1, 2, 3) Best results can be obtained by
using a thermal transfer compound with a heat con-
ductivity of at least 2.9 W/mK. The flatness of the
cooling plate must be better than 0.05 mm overall.
Surface roughness should not exceed 6.4 μm.
