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BSL207NH6327XTSA1
P1-P3
P4-P6
P7-P9
BSL207N
OptiMOS
™
2 Small-Signal-Transi
stor
Features
• Dual N-channel
• Enhancement m
ode
• Super Logic lev
el (2.5V rated)
• Avalanche rated
• Qualified according to AEC Q101
• 100% lead-free; RoHS compliant
• Halogen free according to IEC61249
-2-21
Maximum ratings,
at
T
j
=25 °C, unless otherw
ise specified
Parameter
1)
Symbol
Conditions
Unit
Continuous drain current
I
D
T
A
=25 °C
2.1
A
T
A
=70 °C
1.7
Pulsed drain current
I
D,pulse
T
A
=25 °C
8.4
Avalanche energy
, si
ngle pulse
E
AS
I
D
=2.1A,
R
GS
=25
W
10.8
mJ
Reverse diode d
v
/d
t
d
v
/d
t
I
D
=2.1A,
V
DS
=16 V,
d
i
/d
t
=200 A/µs,
T
j,max
=150 °C
6
kV/µs
Gate source voltage
V
GS
±12
V
Power dissipati
on
1)
P
tot
T
A
=25 °C
W
Operating and storage temperature
T
j
,
T
stg
-55 ... 150
°C
ESD Class
JESD22-A114 -HBM
0 (<250V)
Soldering Temperature
260 °C
IEC climatic category; DIN IE
C 68-1
55/150/56
1)
Remark: one
of both trans
istors i
n operation
Value
0.5
PG
-T
SOP6
1
2
3
4
5
6
Type
Package
Tape and Reel Inform
ation
Marking
Lead Free
Packing
BSL207N
TSOP-6
H6327: 3000 pcs/ reel
sPL
Yes
Non dry
V
DS
20
V
R
DS(on),max
V
GS
=4.5 V
70
m
W
V
GS
=2.5 V
110
I
D
2.1
A
Product Summary
Rev 2.3
page 1
2013-11-06
BSL207N
Parameter
Symbol
Conditions
Unit
min.
typ.
max.
Thermal characteristics
Therm
al resistance,
junction - ambient
R
thJA
minim
al footprint
2)
-
-
250
K/W
Electrical characteristics,
at
T
j
=25 °C, unless otherw
ise specified
Static characteristics
Drain-source breakdown voltage
V
(BR)DSS
V
GS
= 0 V,
I
D
= 250 µA
20
-
-
V
Gate threshold voltag
e
V
GS(th)
V
DS
=V
GS
,
I
D
=11 µA
0.7
0.95
1.2
Drain-source leakage current
I
DSS
V
DS
=20 V,
V
GS
=0 V,
T
j
=25 °C
-
-
1
m
A
V
DS
=20 V,
V
GS
=0 V,
T
j
=150 °C
-
-
100
Gate-source leakage current
I
GSS
V
GS
=12 V,
V
DS
=0 V
-
-
100
nA
Drain-source on-state resistance
R
DS(on)
V
GS
=2.5V,
I
D
=1.7 A
-
81
110
m
W
V
GS
=4.5 V,
I
D
=2.1 A
-
58
70
Transconductance
g
fs
|
V
DS
|>2|
I
D
|
R
DS(on)ma
x
,
I
D
=1.7 A
-
7
-
S
Values
2)
Performed on
a 40mm
2
FR4 PCB. The traces a
re1mm wide, 70
μ
m thi
ck and 20
mm long;
they are present
on both
sides of
the PCB.
Rev 2.3
page 2
2013-11-06
BSL207N
Parameter
Symbol
Conditions
Unit
min.
typ.
max.
Dynamic characteristics
Input capacitance
C
iss
-
315
419
pF
Output capacitance
C
oss
-
114
152
Reverse transfer capacitance
C
rss
-
16
24
Turn-on delay
time
t
d(on)
-
5.4
-
ns
Rise time
t
r
-
2.8
-
Turn-of
f delay
time
t
d(off)
-
11
-
Fall time
t
f
-
2.4
-
Gate Charge Characteristics
Gate to source charge
Q
gs
-
0.65
-
nC
Gate to drain charge
Q
gd
-
0.4
-
Gate charge total
Q
g
-
2.1
-
Gate plateau vol
tage
V
plateau
-
2
-
V
Reverse Diode
Diode continous forward current
I
S
-
-
0.5
A
Diode pulse current
I
S,pulse
-
-
8.4
Diode forward voltag
e
V
SD
V
GS
=0 V,
I
F
=2.1 A,
T
j
=25 °C
-
0.8
1.2
V
Reverse recovery
time
t
rr
-
10
-
ns
Reverse recovery
charge
Q
rr
-
2.4
-
nC
V
R
=10 V,
I
F
=2.1 A,
d
i
F
/d
t
=100 A/µs
T
A
=25 °C
Values
V
GS
=0 V,
V
DS
=10 V,
f
=1 MHz
V
DD
=10 V,
V
GS
=4.5 V,
I
D
=2.1A,
R
G,ext
=6
W
V
DD
=10 V,
I
D
=2.1 A,
V
GS
=0 to 4.5 V
Rev 2.3
page 3
2013-11-06
P1-P3
P4-P6
P7-P9
BSL207NH6327XTSA1
Mfr. #:
Buy BSL207NH6327XTSA1
Manufacturer:
Infineon Technologies
Description:
MOSFET SMALL SIGNAL+P-CH
Lifecycle:
New from this manufacturer.
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