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CENTELLAX
UA5M20MC Datasheet
Specifications subject to change without notice. Copyright © 2001-2007 Centellax, Inc. Printed in USA. 27 Jun 2007.
Applications Support
Alternate assembly diagrams and other additional
application support are available upon request.
Visit the Centellax website for large printable
assembly diagrams and application notes:
http://www
.centellax.com/products/microwave/mmi
cs/UA5M20MC.shtml.
Pick-up and Chip Handling:
This MMIC has exposed air bridges on the top sur-
face. Do not pick up chip with vacuum on the
die center; handle from edges or with a custom
collet.
Thermal Heat Sinking:
To avoid damage and for optimum performance,
you must observe the maximum channel tempera-
ture and ensure adequate heat sinking.
ESD Handling and Bonding:
This MMIC is ESD sensitive; preventive meas-
ures should be taken during handling, die attach,
and bonding.
Epoxy die attach is recommended. Please visit
our website for more handling, die attach and bond-
ing information: http://www
.centellax.com/.
Recommended Components
>100pF 25x25mil Byp
ass Capacitor:
Presidio SL2525X7R101K16VH
Die size, pad locations, and pad descriptions
Single supply (self-biased) assembly diagram
Dual supply (externally-biased) assembly diagram
Chip size: 920x920um (36.2x36.2mil)
Chip size tolerance: ±5um (0.2mil)
Chip thickness: 100 ±10um (4 ±0.4mil)
Pad dimensions: 80x80um (3.1x3.1mil)
