FDS6614A

FDS6614A
FDS6614A Rev. C
Features
9.3 A, 30 V. R
DS(on)
= 0.018 W @ V
GS
= 10 V
R
DS(on)
= 0.025 W @ V
GS
= 4.5 V.
Low gate charge (12nC typical).
Fast switching speed.
High performance trench technology for extremely
low R
DS(on)
.
High power and current handling capability.
ã1999 Fairchild Semiconductor Corporation
January 2000
1
6
7
8
2
4
3
5
Absolute Maximum Ratings
T
A
=25
o
C unless otherwise noted
Symbol
Parameter
Ratings
Units
V
DSS
Drain-Source Voltage 30 V
V
GSS
Gate-Source Voltage
±
20
V
I
D
Drain Current - Continuous
(Note 1a)
9.3 A
- Pulsed 40
Power Dissipation for Single Operation (Note 1a) 2.5
(Note 1b)
1.2
P
D
(Note 1c)
1.0
W
T
J
, T
stg
Operating and Storage Junction Temperature Range -55 to +150
°C
Thermal Characteristics
R
θ
JA
Thermal Resistance, Junction-to-Ambient
(Note 1a) 50
°
C/W
R
θ
JC
Thermal Resistance, Junction-to-Case
(Note 1)
25
°
C/W
Package Marking and Ordering Information
Device Marking Device Reel Size Tape width
Quantity
FDS6614A FDS6614A 13’’ 12mm 2500 units
S
D
S
S
SO-8
D
D
D
G
FDS6614A
N-Channel Logic Level PowerTrench
®
MOSFET
This N-Channel Logic Level MOSFET is produced using
Fairchild Semiconductor's advanced PowerTrench process
that has been especially tailored to minimize on-state
resistance and yet maintain superior switching performance.
These devices are well suited for low voltage and battery
powered applications where low in-line power loss and fast
switching are required.
Applications
DC/DC converter
Load switch
Motor drives
General Description
FDS6614A
FDS6614A Rev. C
Notes:
1. R
qJA
is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface
of the drain pins. R
qJC
is guaranteed by design while R
qJA
is determined by the user's board design.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width £ 300 ms, Duty Cycle £ 2.0%
a) 50° C/W when
mounted on a 1 in
2
pad of 2 oz. copper.
b) 105° C/W when
mounted on a 0.04 in
2
pad of 2 oz. copper.
c) 125° C/W when
mounted on a minimum pad.
DMOS Electrical Characteristics T
A
= 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BV
DSS
Drain-Source Breakdown Voltage
V
GS
= 0 V, I
D
= 250 µA
30 V
BVDSS
T
J
Breakdown Voltage Temperature
Coefficient
I
D
= 250 µA, Referenced to 25°C
24
mV/°C
I
DSS
Zero Gate Voltage Drain Current V
DS
= 24 V, V
GS
= 0 V 1
µA
I
GSSF
Gate-Body Leakage Current, Forward V
GS
= 20 V, V
DS
= 0 V 100 nA
I
GSSR
Gate-Body Leakage Current, Reverse V
GS
= 20 V, V
DS
= 0 V -100 nA
On Characteristics (Note 2)
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
, I
D
= 250 µA
1 1.6 3 V
VGS(th)
T
J
Gate Threshold Voltage
Temperature Coefficient
I
D
= 250 µA, Referenced to 25°C
4
mV/°C
R
DS(on)
Static Drain-Source
On-Resistance
V
GS
= 10 V, I
D
= 9.3 A
V
GS
= 10 V, I
D
= 9.3 A
T
J
@ 125°C
V
GS
= 4.5 V, I
D
= 8 A
0.015
0.022
0.019
0.018
0.030
0.025
I
D(on)
On-State Drain Current V
GS
= 10 V, V
DS
= 5 V 20 A
g
FS
Forward Transconductance V
DS
= 5 V, I
D
= 9.3 A 26 S
Dynamic Characteristics
C
iss
Input Capacitance 1160 pF
C
oss
Output Capacitance 250 pF
C
rss
Reverse Transfer Capacitance
V
DS
= 15 V, V
GS
= 0 V,
f = 1.0 MHz
100 pF
Switching Characteristics (Note 2)
t
d(on)
Turn-On Delay Time 9 17 ns
t
r
Turn-On Rise Time 11 20 ns
t
d(off)
Turn-Off Delay Time 23 37 ns
t
f
Turn-Off Fall Time
V
DD
= 15 V, I
D
= 1 A,
V
GS
= 10 V, R
GEN
= 6
8 16 ns
Q
g
Total Gate Charge 12 17 nC
Q
gs
Gate-Source Charge 3.2 nC
Q
gd
Gate-Drain Charge
V
DS
= 15 V, I
D
= 9.3 A,
V
GS
= 5 V
3.7 nC
Drain-Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain-Source Diode Forward Current 2.1 A
V
SD
Drain-Source Diode Forward Voltage V
GS
= 0 V, I
S
= 2.1 A (Note 2) 0.75 1.2 V
FDS6614A
FDS6614A Rev. C
Typical Characteristics
Figure 1. On-Region Characteristics
Figure 2. On-Resistance Variation
with Drain Current and Gate Voltage
Figure 5. Transfer Characteristics Figure 6. Body Diode Forward Voltage
Variation with Source Current
and Temperature
Figure 3. On-Resistance Variation
with Temperature
Figure 4. On-Resistance Variation
with Gate-to-Source Voltage
0.0001
0.001
0.01
0.1
1
10
100
0 0.2 0.4 0.6 0.8 1 1.2 1.4
V
SD
, BODY DIODE FORWARD VOLTAGE (V)
I
S
, REVERSE DRAIN CURRENT (A)
T
A
= 125
o
C
25
o
C
-55
o
C
V
GS
= 0V
0
10
20
30
40
00.511.522.53
V
DS
, DRAIN-SOURCE VOLTAGE (V)
I
D
, DRAIN-SOURCE CURRENT (A)
V
GS
= 10V
3.0V
2.5V
4.5V
3.5V
6.0V
4.0V
0
0.01
0.02
0.03
0.04
0.05
0.06
246810
V
GS
, GATE TO SOURCE VOLTAGE (V)
R
DS(ON)
, ON-RESISTANCE (OHM)
I
D
= 4.7 A
T
A
= 125
o
C
T
A
= 25
o
C
0.8
1
1.2
1.4
1.6
1.8
2
2.2
2.4
2.6
0 1020304050
I
D
, DRAIN CURRENT (A)
R
DS(ON)
, NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
V
GS
= 3.0V
10V
4.0V
3.5V
5.0V
7.0V
4.5V
0
10
20
30
40
50
12345
V
GS
, GATE TO SOURCE VOLTAGE (V)
I
D
, DRAIN CURRENT (A)
T
A
= -55
o
C
25
o
C
125
o
C
V
DS
= 5V
0.6
0.8
1
1.2
1.4
1.6
1.8
-50 -25 0 25 50 75 100 125 150
T
J
, JUNCTION TEMPERATURE (
o
C)
R
DS(ON)
, NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
I
D
= 9.3A
V
GS
= 10V

FDS6614A

Mfr. #:
Manufacturer:
ON Semiconductor / Fairchild
Description:
MOSFET SO-8 N-CH 30V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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