8
217 C
200 C
60 - 120 SEC.
6 C/SEC. MAX.
3 C/SEC. MAX.
(Acc. to J-STD-020C)
3 C/SEC. MAX.
150 C
255 - 260 C
100 SEC. MAX.
10 to 30 SEC.
TIME
TEMPERATURE
LAMINAR WAVE
BOTTOM SIDE
OF PC BOARD
HOT AIR KNIFE
TURBULENT WAVE
FLUXING
PREHEAT
0 10 20
30
50
100
150
200
250
30 40 50
TIME – SECONDS
TEMPERATURE – C
60 70 80 90 100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
LEADED SOLDER: SN63; FLUX: RMA
LEAD-FREE SOLDER: 96.5 wt% SN, 3 wt% Ag, 0.5 wt% Cu
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
Figure 7. Radiation Pattern.
Figure 9. Recommended wave soldering prole.
Figure 8. Recommended Pb-free reow soldering prole.
Note: For detail information on reow soldering of Avago surface
mount LEDs, do refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components.
Reow soldering must not be done more than 2 times. Do observe
necessary precautions of handling moisture sensitive device as stated
in below section.
0 20
CURRENT – mA
460
480
540
DOMINANT WAVELENGTH – nm
35
500
470
510
10
490
520
25
GREEN
5 15 30
530
CYAN
BLUE
DELTA V
F
(NORMALIZED AT 25°C)
-0.3
-100
TEMPERATURE – °C
0.5
0.4
0.2
0.1
0
-0.2
15050-50
0 100
-0.1
0.3
GaP/AlGaAs/
AlInGaP
InGaN/GaN
NORMALIZED INTENSITY
1.0
0
ANGULAR DISPLACEMENT – DEGREES
0.8
0.6
0.2
0.4
-70 -50
-30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80
Figure 6. Forward voltage shift vs. temperature.Figure 5. Dominant wavelength vs. forward current – InGaN devices.
