
FDW264P Rev. C (W)
Electrical Characteristics T
A
= 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BV
DSS
Drain–Source Breakdown Voltage
V
GS
= 0 V, I
D
= –250 µA
–20 V
∆BVDSS
∆T
J
Breakdown Voltage Temperature
Coefficient
I
D
= –250 µA, Referenced to 25°C
–17
mV/°C
I
DSS
Zero Gate Voltage Drain Current V
DS
= –16 V, V
GS
= 0 V –1
µA
I
GSS
Gate–Body Leakage V
GS
= ±12 V, V
DS
= 0 V ±100 nA
On Characteristics (Note 2)
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
, I
D
= –250 µA
–0.6 –0.9 –1.5 V
∆VGS(th)
∆T
J
Gate Threshold Voltage
Temperature Coefficient
I
D
= –250 µA, Referenced to 25°C
3
mV/°C
R
DS(on)
Static Drain–Source
On–Resistance
V
GS
= –4.5 V, I
D
= –9.7 A
V
GS
= –2.5 V, I
D
= –8.4 A
V
GS
= –4.5 V, I
D
= –9.7 A, T
J
= 125°C
7.5
9.0
10.5
10
14.5
mΩ
I
D(on)
On–State Drain Current V
GS
= –4.5 V, V
DS
= –5 V –50 A
g
FS
Forward Transconductance V
DS
= –10 V, I
D
= –9.7 A 71 S
Dynamic Characteristics
C
iss
Input Capacitance 7225 pF
C
oss
Output Capacitance 1030 pF
C
rss
Reverse Transfer Capacitance
V
DS
= –10 V, V
GS
= 0 V,
f = 1.0 MHz
900 pF
R
G
Gate Resistance
V
GS
= 15mV, f = 1.0 MHz
10
Ω
Switching Characteristics (Note 2)
t
d(on)
Turn–On Delay Time 17 31 ns
t
r
Turn–On Rise Time 17 31 ns
t
d(off)
Turn–Off Delay Time 480 770 ns
t
f
Turn–Off Fall Time
V
DD
= –10 V, I
D
= –1 A,
V
GS
= –4.5 V, R
GEN
= 6 Ω
265 422 ns
Q
g
Total Gate Charge 95 135 nC
Q
gs
Gate–Source Charge 13 nC
Q
gd
Gate–Drain Charge
V
DS
= –10 V, I
D
= –9.7 A,
V
GS
= –5 V
24 nC
Drain–Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain–Source Diode Forward Current –1.1 A
V
SD
Drain–Source Diode Forward
Voltage
V
GS
= 0 V, I
S
= –1.1 A (Note 2) –0.6 –1.2 V
T
rr
Reverse Recovery Time
170
ns
Q
rr
Reverse Recovery Charge
I
F
= –9.7 A,
d
iF
/d
t
= 100 A/µs (Note 3)
220
nC
Notes:
1. R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface
of the drain pins. R
θJC
is guaranteed by design while R
θCA
is determined by the user's board design.
a) R
θJA
is 96°C/W (steady state) when mounted on a 1 inch² copper pad on FR-4.
b) R
θJA
is 208°C/W (steady state) when mounted on a minimum copper pad on FR-4.
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDW264P