AD5541A
Rev. A | Page 8 of 20
08516-004
NOTES
1. FOR INCREASED RELIABILI
Y OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY,
IT IS RECOMMENDED THAT THE PAD BE SOLDERED
TO THE SUBSTRATE, GND.
3SCLK
4DIN
1REF
2CS
6V
OUT
5CLR
8GND
7V
DD
TOP VIEW
(Not to Scale)
AD5541A-1
Figure 5. AD5541A-1 8-Lead LFCSP Pin Configuration
08516-005
1V
DD
2V
OUT
3AGND
4REF
5
10 V
LOGIC
9DGND
8
7DIN
6SCLK
TOP VIEW
(Not to Scale)
AD5541A
CS
LDAC
NOTES
1. FOR INCREASED RELIABILI
Y OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY,
IT IS RECOMMENDED THAT THE PAD BE SOLDERED
TO THE SUBSTRATE, GND.
Figure 6. AD5541A 10-Lead LFCSP Pin Configuration
Table 7. AD5541A-1 and AD5541A Pin Function Descriptions
Pin No.
8-Lead LFCSP 10-Lead LFCSP
Mnemonic Description
1 4 REF
Voltage Reference Input for the DAC. Connect to an external 2.5 V reference. The
reference can range from 2 V to V
DD
.
2 5
CS
Logic Input Signal. The chip select signal is used to frame the serial data input.
3 6 SCLK
Clock Input. Data is clocked into the serial input register on the rising edge of SCLK.
Duty cycle must be between 40% and 60%.
4 7 DIN
Serial Data Input. This device accepts 16-bit words. Data is clocked into the serial input
register on the rising edge of SCLK.
5 N/A
1
CLR
Asynchronous Clear Input. The CLR input is falling edge sensitive. When CLR is low, all
LDAC
pulses are ignored. When CLR is activated, the serial input register and the DAC
register are cleared to zero scale.
6 2 V
OUT
Analog Output Voltage from the DAC.
N/A
1
9 DGND Digital Ground. Ground reference for digital circuitry.
7 1 V
DD
Analog Supply Voltage.
8 N/A
1
GND Ground Reference Point for Both Analog and Digital Circuitry.
N/A
1
3 AGND Ground Reference Point for Analog Circuitry.
N/A
1
10 V
LOGIC
Logic Power Supply.
N/A
1
8
LDAC
LDAC Input. When this input is taken low, the DAC register is simultaneously updated
with the contents of the serial input register.
EPAD
Exposed Pad. For increased reliability of the solder joints and maximum thermal
capability, it is recommended that the pad be soldered to the substrate, GND.
1
N/A means not applicable.