X0202NA 1BA2

January 2011 Doc ID 7480 Rev 4 1/11
11
X02
1.25 A sensitive gate SCR
Features
on-state rms current: 1.25 A
repetitive peak off-state voltage: 600 V and
800 V
gate triggering current:
50 and 200 µA
Applications
ground fault circuit interrupters
overvoltage crowbar protection in power
supplies
capacitive ignition circuits
Description
The X02 SCR can be used as the on/off function
in applications where topology does not offer high
current for gate triggering.
This device is optimized in forward voltage drop
and inrush current capabilities for reduced power
losses and high reliability in harsh environments.
A
K
G
A
A
K
G
A
K
G
A
K
G
SOT-223
X02xxN
TO-92
X02xxA
SMBflat-3L
X0202NUF
Table 1. Device summary
Order code
Voltage
Sensitivity µA Package
600 V 800 V
X0202MA Y 200 TO-92
X0202MN Y 200 SOT-223
X0202NA Y 200 TO-92
X0202NN Y 200 SOT-223
X0205MA Y 50 TO-92
X0205NA Y 50 TO-92
X0202NUF Y 200 SMBflat-3L
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Characteristics X02
2/11 Doc ID 7480 Rev 4
1 Characteristics
Table 2. Absolute ratings (limiting values, T
J
= 25 °C unless otherwise specified)
Symbol Parameter Value Unit
I
T(RMS)
On-state rms current (180 °Conduction angle)
TO-92 T
L
= 63 °C
1.25 ASOT-223 T
tab
= 99 °C
SMBflat-3L T
tab
= 111 °C
IT
(AV)
Average on-state current (180 °Conduction angle)
TO-92 T
L
= 63 °C
0.8 ASOT-223 T
tab
= 99 °C
SMBflat-3L T
tab
= 111 °C
I
TSM
Non repetitive surge peak on-state current
t
p
= 8.3 ms
T
j
= 25 °C
25
A
t
p
= 10 ms 22.5
I
²
tI
²
t Value for fusing t
p
= 10 ms T
j
= 25 °C 2.5 A
2
s
di/dt
Critical rate of rise of on-state current
I
G
= 2 x I
GT
, t
r
100 ns
F = 60 Hz T
j
= 125 °C 50 A/µs
I
GM
Peak gate current t
p
= 20 µs T
j
= 125 °C 1.2 A
P
G(AV)
Average gate power dissipation T
j
= 125 °C 0.2 W
T
stg
T
j
Storage junction temperature range
Operating junction temperature range
- 40 to + 150
- 40 to + 125
°C
Table 3. Electrical characteristics (T
J
= 25 °C unless otherwise specified)
Symbol Test conditions X0202 X0205 Unit
I
GT
V
D
= 12 V, R
L
= 140 Ω
Min. 20
µA
Max. 200 50
V
GT
Max. 0.8 V
V
GD
V
D
= V
DRM,
R
L
= 3.3 kΩ , R
GK
= 1 kΩ T
j
= 125 °C Min. 0.1 V
V
RG
I
RG
= 10 µA Min. 8 V
I
H
I
T
= 50 mA, R
GK
= 1 kΩ Max. 5 mA
I
L
I
G
= 1 mA, R
GK
= 1 kΩ Max. 6 mA
dV/dt V
D
= 67% V
DRM,
R
GK
= 1 kΩ T
j
= 110 °C Min. 10 15 V/µs
Table 4. Static electrical characteristics
Symbol Test conditions X0202 X0205 Unit
V
TM
I
TM
= 2.5 A, t
p
= 380 µs T
j
= 25 °C
Max.
1.45 V
V
TO
Threshold voltage
T
j
= 125 °C
0.9 V
R
d
Dynamic resistance 200 mΩ
I
DRM
I
RRM
V
DRM
= V
RRM,
R
GK
= 1 kΩ
T
j
= 25 °C 5 µA
T
j
= 125 °C 500
µA
X02 Characteristics
Doc ID 7480 Rev 4 3/11
Table 5. Thermal resistances
Symbol Parameter Value Unit
R
th(j-l)
Junction to leads (DC) TO-92
Max.
60
°C/W
R
th(j-t)
Junction to tab (DC) SOT-223 25
R
th(j-t)
Junction to tab (DC) SMBflat-3L 14
R
th(j-a)
Junction to ambient (DC)
TO-92 150
S = 5 cm
2
SOT-223 60
SMBflat-3L 75
Figure 1. Maximum average power
dissipation versus average
on-state current (full cycle)
Figure 2. Average and DC on-state current
versus tab (SOT-223, SMBflat-3L) or
lead (TO-92) temperature
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
P(W)
α = 180°
I (A)
T(AV)
360°
α
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 25 50 75 100 125
D.C. (SMBflat-3L)
D.C. (TO-92)
D.C. (SOT-223)
α = 180° (SMBflat-3L)
α = 180° (SOT-223)
α = 180° (TO-92)
T or T (°C)
lead tab
I (A)
T(AV)
Figure 3. Average and DC on-state current
versus ambient temperature
Figure 4. Relative variation of thermal
impedance junction to ambient
versus pulse duration
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 25 50 75 100 125
I (A)
T(AV)
D.C. (SMBflat-3L)
D.C. (TO-92)
D.C. (SOT-223)
α = 180° (SMBflat-3L)
α = 180° (SOT-223)
α = 180° (TO-92)
T (°C)
amb
K=[Z /R
th(j-a) th(j-a)
]
0.01
0.10
1.00
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05
TO-92
SOT-223
t (s)
p
SMBflat-3L

X0202NA 1BA2

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
SCRs 1.25 Amp 800 Volt
Lifecycle:
New from this manufacturer.
Delivery:
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