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PCA9550D,112

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P26
PCA9550_5 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 05 — 13 October 2008 22 of 26
NXP Semiconductors
PCA9550
2-bit I
2
C-bus LED driver with programmable blink rates
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
15.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 26) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 15 and 16
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 26.
Table 15. SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm
3
)
< 350 ≥ 350
< 2.5 235 220
≥ 2.5 220 220
Table 16. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm
3
)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
PCA9550_5 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 05 — 13 October 2008 23 of 26
NXP Semiconductors
PCA9550
2-bit I
2
C-bus LED driver with programmable blink rates
For further information on temperature profiles, refer to Application Note
AN10365
“Surface mount reflow soldering description”
.
16. Abbreviations
MSL: Moisture Sensitivity Level
Fig 26. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 17. Abbreviations
Acronym Description
AI Auto-Increment
CDM Charged Device Model
DSP Digital Signal Processor
DUT Device Under Test
ESD ElectroStatic Discharge
GPIO General Purpose Input/Output
HBM Human Body Model
I
2
C-bus Inter IC bus
I/O Input/Output
IC Integrated Circuit
LED Light Emitting Diode
MCU MicroController Unit
MM Machine Model
MPU MicroProcessor Unit
POR Power-On Reset
PWM Pulse Width Modulation
RC Resistor-Capacitor network
SMBus System Management Bus
PCA9550_5 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 05 — 13 October 2008 24 of 26
NXP Semiconductors
PCA9550
2-bit I
2
C-bus LED driver with programmable blink rates
17. Revision history
Table 18. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PCA9550_5 20081013 Product data sheet - PCA9550_4
Modifications:
• Section 8.1 “Minimizing I
DD
when the I/Os are used to control LEDs”, 1
st
paragraph,
3
rd
sentence changed from “The supply current, I
DD
, increases as V
I
becomes lower than
V
DD
and is specified as ∆I
DD
in Table 13 “Static characteristics”.” to “The supply current, I
DD
,
increases as V
I
becomes lower than V
DD
.”
• Table 13 “Static characteristics”, sub-section “Supplies”: removed ∆I
DD
characteristic
• Table 13 “Static characteristics”, sub-section “I/Os”, symbol I
OL
, LOW-level output current:
– condition V
OL
= 0.4 V; V
DD
= 2.3 V: changed Min value from “9 mA” to “6 mA”;
changed Typ value from “-” to “9 mA”
– condition V
OL
= 0.4 V; V
DD
= 3.0 V: changed Min value from “11 mA” to “8 mA”;
changed Typ value from “-” to “11 mA”
– condition V
OL
= 0.4 V; V
DD
= 5.0 V: changed Min value from “14 mA” to “10 mA”;
changed Typ value from “-” to “14 mA”
– condition V
OL
= 0.7 V; V
DD
= 2.3 V: changed Min value from “14 mA” to “11 mA”;
changed Typ value from “-” to “14 mA”
– condition V
OL
= 0.7 V; V
DD
= 3.0 V: changed Min value from “18 mA” to “14 mA”;
changed Typ value from “-” to “18 mA”
– condition V
OL
= 0.7 V; V
DD
= 5.0 V: changed Min value from “24 mA” to “17 mA”;
changed Typ value from “-” to “24 mA”
• updated soldering information
PCA9550_4 20080107 Product data sheet - PCA9550_3
PCA9550_3
(9397 750 13719)
20041001 Product data sheet - PCA9550_2
PCA9550_2
(9397 750 11461)
20030502 Product data ECN 853-2396 29859 of
24 Apr 2003
PCA9550_1
PCA9550_1
(9397 750 10857)
20021213 Product data ECN 853-2396 29264 of
09 Dec 2002
-
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PCA9550D,112

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Buy PCA9550D,112
Manufacturer:
NXP Semiconductors
Description:
LED Lighting Drivers 2-BIT I2C FM OD LED
Lifecycle:
New from this manufacturer.
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