DMN2020LSN-7

DMN2020LSN
Document number: DS31946 Rev. 3 - 2
1 of 6
www.diodes.com
August 2011
© Diodes Incorporated
DMN2020LSN
NEW PRODUCT
N-CHANNEL ENHANCEMENT MODE MOSFET
Features
Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
ESD Protected Up To 2KV
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SC-59
Case Material - Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Terminal Connections: See Diagram
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.014 grams (approximate)
Maximum Ratings @T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Units
Drain-Source Voltage
V
DSS
20 V
Gate-Source Voltage Continuous
V
GSS
±12 V
Continuous Drain Current
Steady
State
T
A
= 25°C
T
A
= 85°C
I
D
6.9
4.5
A
Pulsed Drain Current (Note 4)
I
DM
30 A
Thermal Characteristics
Characteristic Symbol Value Units
Power Dissipation (Note 3)
P
D
0.61 W
Thermal Resistance, Junction to Ambient @T
A
= 25°C (Note 3)
R
θ
JA
204
°C /W
Operating and Storage Temperature Range
T
J
, T
STG
-55 to +150
°C
Notes: 1. No purposefully added lead.
2. Diodes Inc.'s "Green" Policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB, with minimum recommended pad layout.
4. Repetitive rating, pulse width limited by junction temperature.
SC-59
TOP VIEW
Pin Out Confi
g
uration
TOP VIEW
EQUIVALENT CIRCUIT
Source
Gate
Protection
Diode
Gate
Drain
D
G
S
ESD PROTECTED TO 2kV
DMN2020LSN
Document number: DS31946 Rev. 3 - 2
2 of 6
www.diodes.com
August 2011
© Diodes Incorporated
DMN2020LSN
NEW PRODUCT
Electrical Characteristics @T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage BV
DSS
20 - - V V
GS
= 0V, I
D
= 250μA
Zero Gate Voltage Drain Current T
J
= 25°C I
DSS
- - 1.0
μA
V
DS
= 20V, V
GS
= 0V
Gate-Source Leakage I
GSS
- - ±10
μA
V
GS
= ±12V, V
DS
= 0V
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage V
GS
(
th
)
0.5 1.0 1.5 V V
DS
= V
GS
, I
D
= 250μA
Static Drain-Source On-Resistance R
DS (ON)
-
13
18
20
28
mΩ
V
GS
= 4.5V, I
D
= 9.4A
V
GS
= 2.5V, I
D
= 8.3A
Forward Transfer Admittance |Y
fs
| - 16 - S V
DS
= 5V, I
D
= 9.4A
Diode Forward Voltage V
SD
- 0.7 1.2 V V
GS
= 0V, I
S
= 1.3A
DYNAMIC CHARACTERISTICS (Note 6)
Input Capacitance C
iss
- 1149 - pF
V
DS
= 10V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance C
oss
- 157 - pF
Reverse Transfer Capacitance C
rss
- 142 - pF
Gate Resistance R
g
- 1.51 -
Ω
V
DS
= 0V, V
GS
= 0V, f = 1MHz
Total Gate Charge Q
g
- 11.6 - nC
V
GS
= 4.5V, V
DS
= 10V,
I
D
= 9.4A
Gate-Source Charge Q
g
s
- 2.7 - nC
Gate-Drain Charge Q
g
d
- 3.4 - nC
Turn-On Delay Time t
D
(
on
)
- 11.67 - ns
V
DD
= 10V, V
GS
= 4.5V,
R
GEN
= 6, I
D
= 1A
Turn-On Rise Time t
r
- 12.49 - ns
Turn-Off Delay Time t
D
(
off
)
- 35.89 - ns
Turn-Off Fall Time t
f
- 12.33 - ns
Notes: 5. Short duration pulse test used to minimize self-heating effect.
6. Guaranteed by design. Not subject to production testing.
0
5
10
15
20
0 0.5 1 1.5 2
Fig. 1 Typical Output Characteristics
V , DRAIN-SOURCE VOLTAGE (V)
DS
I, D
R
AIN
C
U
R
R
EN
T
(A)
D
V = 1.5V
GS
V = 1.8V
GS
V = 2.0V
GS
V = 2.5V
GS
V = 3.0V
GS
V = 4.5V
GS
V = 8.0V
GS
0
5
10
15
20
0 0.5 1 1.5 2 2.5 3
Fig. 2 Typical Transfer Characteristics
V , GATE SOURCE VOLTAGE (V)
GS
I, D
AIN
EN
(A)
D
V = 10V
DS
T = -55°C
A
T = 25°C
A
T = 125°C
A
T = 150°C
A
T = 85°C
A
DMN2020LSN
Document number: DS31946 Rev. 3 - 2
3 of 6
www.diodes.com
August 2011
© Diodes Incorporated
DMN2020LSN
NEW PRODUCT
0
0.01
0.02
0.03
0.04
0.05
0.06
02 468101214161820
, D
AI
-S
E
-
ESIS
A
E ( )
DS(ON)
Ω
Fig. 3 Typical On-Resistance
vs. Drain Current and Gate Voltage
I , DRAIN-SOURCE CURRENT (A)
D
V = 1.8V
GS
V = 4.5V
GS
V = 2.5V
GS
0
0.01
0.02
0.03
0.04
0 2 4 6 8 101214 161820
I , DRAIN CURRENT (A)
Fig. 4 Typical Drain-Source On-Resistance
vs. Drain Current and Temperature
D
, D
AI
-S
E
-
ESIS
A
E ( )
DS(ON)
Ω
V = 4.5V
GS
T = -55°C
A
T = 25°C
A
T = 85°C
A
T = 125°C
A
T = 150°C
A
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Fig. 5 On-Resistance Variation with Temperature
-50 -25 0 25 50 75 100 125 150
T , JUNCTION TEMPERATURE (°C)
J
R , DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
DS(ON)
V = 2.5V
I = 150mA
GS
D
V = 4.5V
I = 500mA
GS
D
0
0.01
0.02
0.03
0.04
Fig. 6 On-Resistance Variation with Temperature
-50 -25 0 25 50 75 100 125 150
T , JUNCTION TEMPERATURE (°C)
J
R , DRAIN-SOURCE ON-RESISTANCE ( )
DS(ON)
Ω
V = 4.5V
I = 10A
GS
D
V = 2.5V
I = 5A
GS
D
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
-50 -25 0 25 50 75 100 125 150
T , AMBIENT TEMPERATURE (°C)
A
V , GATE THRESHOLD VOLTAGE (V)
GS(TH)
I = 1mA
D
I = 250µA
D
0
5
10
15
20
0.4 0.6 0.8 1 1.2
V , SOURCE-DRAIN VOLTAGE (V)
SD
Fig. 8 Diode Forward Voltage vs. Current
I, S
O
U
R
C
E
C
U
R
R
EN
T
(A)
S
T = 25°C
A

DMN2020LSN-7

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