LQH44PN220MJ0L

SpecNo.JELF243A-0075G-01 P4/8
MURATA MFG.CO., LTD
Reference Only
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape(cover tape) and trailer-tape (empty tape) as follows.
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ・・・
1) <Expression of Inspection No.> □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) < Expression of RoHS marking > ROHS – Y
()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (2) ,Quantity, etc ・・・
9.8. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity in Outer
Case (Reel)
W D H
186 186 93 4
Above Outer Case size is typical. It depends on a quantity of an order.
10. Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
W
D
Label
H
190 min
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
210 min
φ
60±
1
0
17.0±1.4
φ
180±
0
3
13.0±
1
0
(in mm)
Trailer : 160 min.
Direction of feed
Empty tape
Leader
Cover tape
Label
SpecNo.JELF243A-0075G-01 P5/8
MURATA MFG.CO., LTD
Reference Only
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing (Reflow Soldering)
Recommended land patterns for reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
(in mm)
11.2 Flux, Solder
Flux
Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion
value).
Don’t use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder.
Standard thickness of solder paste : 100μm to 150μm
11.3 Soldering conditions (Reflow)
Pre-heating should be in such a way that the temperature difference between solder and product surface is limited
to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is
limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration
of product quality.
Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
Limit Profile
Standard Profile
90s±30s
230
260
245±3
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
Solder Resist
Chip Colil
Land
2.7
1.50 1.45
4.40
SpecNo.JELF243A-0075G-01 P6/8
MURATA MFG.CO., LTD
Reference Only
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C,1 min
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter φ3mm max.
Soldering time 3(+1,-0)s
Times 2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the products due to the thermal shock.
11.5 Solder Volume
Solder shall be used not to be exceed the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
11.6 Product's location
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
Products direction
The electorode part of the products should be
located like the picture to the mechanical stress.
(2) Products location on P.C.B. separation
Products (A,B,C,D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A>C>B
D.
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at
the mounted products and P.C.B.
Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in
order to remove the cleaner
(5) Other cleaning
Please contact us.
Recommendable
Excessively
(
Poor exam
p
le
(
Good exam
p
le
)
Electrode
Electrode
Slit
Seam
A
D
B
C
Electrode
Electrode

LQH44PN220MJ0L

Mfr. #:
Manufacturer:
Description:
Fixed Inductors 0.55A 22uH
Lifecycle:
New from this manufacturer.
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