4
Absolute Maximum Ratings
Storage Temperature, T
S
–55˚C to +150˚C
Operating Temperature, T
A
–55˚C to +100˚C
Lead Solder Temperature, max. 260˚C for 10 s
(1.6 mm below seating plane)
Average Forward Current, I
F
60 mA
Reverse Input Voltage, V
R
6 V
Input Power Dissipation, P
I
100 mW
Collector Current, I
C
100 mA
Collector-Emitter Voltage, V
CEO
30 V
Emitter-Collector Voltage, V
ECO
7 V
Collector-Base Voltage, V
CBO
70 V
Collector Power Dissipation 300 mW
Total Power Dissipation 350 mW
Isolation Voltage, V
iso
3550 Vrms
(AC for 1 minute, R.H. = 40 ~ 60%)
30 seconds
60 ~ 150 sec 90 sec 60 sec
60 sec
25°C
150°C
200°C
250°C
260°C (Peak Temperature)
217°C
Time (sec)
Temperature
(
°
C)
Solder Reow Temperature Prole
1) One-time soldering reow is recommended within
the condition of temperature and time prole shown
at right.
2) When using another soldering method such as in-
frared ray lamp, the temperature may rise partially
in the mold of the device. Keep the temperature on
the package of the device within the condition of (1)
above.
Note: Non-halide ux should be used.