ADG811/ADG812/ADG813
Rev. B | Page 13 of 16
TERMINOLOGY
I
DD
Positive supply current.
V
D
, V
S
Analog voltage on Terminal D, Terminal S.
R
ON
Ohmic resistance between D and S.
R
FLAT (ON)
Flatness is defined as the difference between the maximum and
minimum value of on resistance as measured over the specified
analog signal range.
ΔR
ON
On resistance match between any two channels, that is,
R
ON
maximum − R
ON
minimum.
I
S
(Off)
Source leakage current with the switch off.
I
D
(Off)
Drain leakage current with the switch off.
I
D
, I
S
(On)
Channel leakage current with the switch on.
V
INL
Maximum input voltage for Logic 0.
V
INH
Minimum input voltage for Logic 1.
I
INL
(I
INH
)
Input current of the digital input.
C
S
(Off)
Off switch source capacitance. Measured with reference to
ground.
C
D
(Off)
Off switch drain capacitance. Measured with reference to
ground.
C
D
, C
S
(On)
On switch capacitance. Measured with reference to ground.
C
IN
Digital input capacitance.
t
ON
Delay time between the 50% and the 90% points of the digital
input and switch on condition.
t
OFF
Delay time between the 50% and the 90% points of the digital
input and switch off condition.
t
BBM
On or off time measured between the 80% points of both
switches, when switching from one to another.
Charge Injection
A measure of the glitch impulse transferred from the digital
input to the analog output during on-to-off switching.
Off Isolation
A measure of unwanted signal coupling through an off switch.
Crosstalk
A measure of unwanted signal that is coupled through from one
channel to another because of parasitic capacitance.
−3 dB Bandwidth
The frequency at which the output is attenuated by 3 dB.
On Response
The frequency response of the on switch.
Insertion Loss
The loss due to the on resistance of the switch.
THD + N
The ratio of the harmonic amplitudes plus noise of a signal to
the fundamental.
ADG811/ADG812/ADG813
Rev. B | Page 14 of 16
OUTLINE DIMENSIONS
16
9
81
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 28. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
1
0.50
BSC
0.60 MAX
PIN 1
INDICATOR
1.50 REF
0.50
0.40
0.30
0.25 MIN
0.45
2.75
BSC SQ
TOP
VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATOR
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
3.00
BSC SQ
*
1.45
1.30 SQ
1.15
EXPOSED
PAD
16
5
13
8
9
12
4
(BOTTOM VIEW)
*
COMPLIANT
TO
JEDEC STANDARDS MO-220-VEED-2
EXCEPT FOR EXPOSED PAD DIMENSION.
072208-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 29. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm × 3 mm Body, Very Thin Quad
(CP-16-2)
Dimensions shown in millimeters
ADG811/ADG812/ADG813
Rev. B | Page 15 of 16
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADG811YRU –40°C to +125°C 16-Lead Thin Shrink Small Outline [TSSOP] RU-16
ADG811YRU-REEL –40°C to +125°C 16-Lead Thin Shrink Small Outline [TSSOP] RU-16
ADG811YRU-REEL7 –40°C to +125°C 16-Lead Thin Shrink Small Outline [TSSOP] RU-16
ADG811YRUZ
1
–40°C to +125°C 16-Lead Thin Shrink Small Outline [TSSOP] RU-16
ADG811YCPZ-REEL
1
–40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-2
ADG811YCPZ-REEL7
1
–40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-2
ADG812YRU –40°C to +125°C 16-Lead Thin Shrink Small Outline [TSSOP] RU-16
ADG812YRU-REEL –40°C to +125°C 16-Lead Thin Shrink Small Outline [TSSOP] RU-16
ADG812YRU-REEL7 –40°C to +125°C 16-Lead Thin Shrink Small Outline [TSSOP] RU-16
ADG812YRUZ
1
–40°C to +125°C 16-Lead Thin Shrink Small Outline [TSSOP] RU-16
ADG812YRUZ-REEL7
1
–40°C to +125°C 16-Lead Thin Shrink Small Outline [TSSOP] RU-16
ADG813YRU –40°C to +125°C 16-Lead Thin Shrink Small Outline [TSSOP] RU-16
ADG813YRU-REEL –40°C to +125°C 16-Lead Thin Shrink Small Outline [TSSOP] RU-16
ADG813YRU-REEL7 –40°C to +125°C 16-Lead Thin Shrink Small Outline [TSSOP] RU-16
ADG813YRUZ
1
–40°C to +125°C 16-Lead Thin Shrink Small Outline [TSSOP] RU-16
1
Z = RoHS Compliant Part.

ADG811YCPZ-REEL7

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog Switch ICs 500mOhm 3.6V CMOS Quad SPST
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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