EVAL-SSM2301-MINI
Rev. 0 | Page 4 of 8
LAYOUT GUIDELINES
1. Place at least nine vias on the thermal solder pad of the
amplifier for proper conduction of heat to the opposite side
of the board. The outer diameter of the vias should be 0.5
mm and the inner diameter should be 0.25 mm to 0.3 mm.
Use a PCB area of at least 2 cm
2
equivalent area on the
opposite side of the layer of the amplifier chip as a heat
sink. Also, extend the ground pad (for the thermal pad) as
much as possible on the amplifier side of the PCB as a heat
sink (see Figure 4). If internal layers are available, allocate a
certain area as a heat sink; make sure to connect the vias
conducting the heat to the internal layers.
07571-004
TOP LAYER
INTERNAL
AND/OR
BOTTOM LAYER
Figure 4. Heat Sink Layout
2. Place the EMI filtering beads, B1 and B2 as close to the
amplifier chip as possible.
3. Place the decoupling capacitors for the beads, C3 and C4,
as close to the amplifier chip as possible, and connect all
their ground terminals together as close as possible. Do not
rely on PCB tracks or ground planes for connecting their
ground terminals together.
4. The 1 nF capacitor and the ferrite bead can block the EMI
for up to 250 MHz. To eliminate EMI higher than 250 MHz,
place a low value small size capacitor, such as a 100 pF, 0402
size capacitor, in parallel with the 1 nF decoupling capacitor.
Place this small capacitor a small distance away from the
1 nF capacitor and use the PCB connection track as an
inductor to form a PI shape low-pass filter.
5. If implementing a PCB track PI filter, the input PCB track
and the output PCB track connection to the decoupling
capacitor should not be connected.
6. Place the decoupling capacitor for the power supply, C5
and C6, as close to the amplifier chip as possible, and
connect its ground terminal directly to the IC ground pins.
