NTGS5120PT1G

© Semiconductor Components Industries, LLC, 2014
August, 2014 Rev. 1
1 Publication Order Number:
NTGS5120P/D
NTGS5120P, NVGS5120P
Power MOSFET
60 V, 2.9 A, Single PChannel, TSOP6
Features
60 V BVds, Low R
DS(on)
in TSOP6 Package
4.5 V Gate Rating
NV Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AECQ101 Qualified and
PPAP Capable
This is a PbFree Device
Applications
High Side Load Switch
Power Switch for Printers, Communication Equipment
MAXIMUM RATINGS (T
J
= 25°C unless otherwise stated)
Parameter Symbol Value Unit
DraintoSource Voltage V
DSS
60 V
GatetoSource Voltage V
GS
$20 V
Continuous Drain
Current (Note 1)
Steady
State
T
A
= 25°C
I
D
2.5
A
T
A
= 85°C 2.0
t v 5 s T
A
= 25°C 2.9
Power Dissipation
(Note 1)
Steady
State
T
A
= 25°C
P
D
1.1
W
t v 5 s 1.4
Continuous Drain
Current (Note 2)
Steady
State
T
A
= 25°C
I
D
1.8
A
T
A
= 85°C 1.3
Power Dissipation
(Note 2)
T
A
= 25°C
P
D
0.6 W
Pulsed Drain Current
t
p
= 10 ms
I
DM
20 A
Operating Junction and Storage Temperature T
J
,
T
STG
55 to
150
°C
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surfacemounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces)
2. Surfacemounted on FR4 board using the minimum recommended pad size.
3
4
1256
PChannel
TSOP6
CASE 318G
STYLE 1
MARKING
DIAGRAM
XX = Device Code
M = Date Code
G = PbFree Package
(Note: Microdot may be in either location)
PIN ASSIGNMENT
321
4
GateDrain
Source
56
Drain
DrainDrain
V
(BR)DSS
R
DS(ON)
MAX I
D
MAX
60 V
111 mW @ 10 V
142 mW @ 4.5 V
http://onsemi.com
XX MG
G
1
1
2.9 A
See detailed ordering and shipping information ion page 5 of
this data sheet.
ORDERING INFORMATION
NTGS5120P, NVGS5120P
http://onsemi.com
2
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol Value Unit
JunctiontoAmbient – Steady State (Note 3)
R
q
JA
102
°C/W
JunctiontoAmbient – t = 5 s (Note 3)
R
q
JA
77.6
JunctiontoAmbient – Steady State (Note 4)
R
q
JA
200
3. Surfacemounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces)
4. Surfacemounted on FR4 board using the minimum recommended pad size.
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise specified)
Parameter
Symbol Test Condition Min Typ Max Unit
OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
V
(BR)DSS
V
GS
= 0 V, I
D
= 250 mA
60 V
Zero Gate Voltage Drain Current I
DSS
V
GS
= 0 V,
V
DS
= 48 V
T
J
= 25°C 1.0 mA
T
J
= 125°C 5.0
GatetoSource Leakage Current I
GSS
V
DS
= 0 V, V
GS
= ±12 V $100 nA
V
DS
= 0 V, V
GS
= ±20 V $200 nA
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
V
GS(TH)
V
GS
= V
DS
, I
D
= 250 mA
1.0 3.0 V
DraintoSource On Resistance R
DS(on)
V
GS
= 10 V, I
D
= 2.9 A 72 111 mW
V
GS
= 4.5 V, I
D
= 2.5 A 88 142
Forward Transconductance g
FS
V
DS
= 5.0 V, I
D
= 6.0 A 10.1 S
CHARGES, CAPACITANCES AND GATE RESISTANCE
Input Capacitance
C
ISS
V
GS
= 0 V, f = 1 MHz, V
DS
= 30 V
942
pF
Output Capacitance C
OSS
72
Reverse Transfer Capacitance C
RSS
48
Total Gate Charge Q
G(TOT)
V
GS
= 10 V, V
DS
= 30 V;
I
D
= 2.9 A
18.1
nC
Threshold Gate Charge Q
G(TH)
1.2
GatetoSource Charge Q
GS
2.7
GatetoDrain Charge Q
GD
3.6
SWITCHING CHARACTERISTICS (Note 6)
TurnOn Delay Time
t
d(ON)
V
GS
= 10 V, V
DS
= 30 V,
I
D
= 1.0 A, R
G
= 6.0 W
8.7
ns
Rise Time t
r
4.9
TurnOff Delay Time t
d(OFF)
38
Fall Time t
f
12.8
DRAINSOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
V
SD
V
GS
= 0 V,
I
S
= 0.9 A
T
J
= 25°C 0.75 1.0 V
Reverse Recovery Time t
RR
V
GS
= 0 V, d
IS
/d
t
= 100 A/ms,
I
S
= 0.9 A
18.3 ns
Charge Time t
a
15.5 ns
Reverse Recovery Charge Q
RR
15.1 nC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
5. Pulse Test: pulse width v 300 ms, duty cycle v 2%
6. Switching characteristics are independent of operating junction temperatures
NTGS5120P, NVGS5120P
http://onsemi.com
3
TYPICAL CHARACTERISTICS
Figure 1. OnRegion Characteristics Figure 2. Transfer Characteristics
V
DS
, DRAINTOSOURCE VOLTAGE (V) V
GS
, GATETOSOURCE VOLTAGE (V)
3.02.52.01.51.00.50
0
0.5
1.0
1.5
2.0
2.5
3.5
3.92.91.90.90.4
0
1.0
2.0
3.0
4.0
5.0
Figure 3. OnResistance vs. Gate Voltage Figure 4. OnResistance vs. Drain Current and
Gate Voltage
V
GS
, GATETOSOURCE VOLTAGE (V) I
D
, DRAIN CURRENT (A)
105.04.03.02.0
0.04
0.06
0.10
7.05.04.03.02.01.0
0.04
0.05
0.06
0.07
0.09
0.10
Figure 5. OnResistance Variation with
Temperature
Figure 6. DraintoSource Leakage Current
vs. Voltage
T
J
, JUNCTION TEMPERATURE (°C) V
DS
, DRAINTOSOURCE VOLTAGE (V)
12510075502502550
0.6
0.8
1.0
1.2
1.4
5040302010
10
100
1000
10,000
I
D
, DRAIN CURRENT (A)
I
D
, DRAIN CURRENT (A)
R
DS(on)
, DRAINTOSOURCE RESISTANCE (W)
R
DS(on)
, DRAINTOSOURCE RES-
ISTANCE (NORMALIZED)
I
DSS
, LEAKAGE (nA)
V
GS
= 2.2 V
2.4 V
2.6 V
3.0 V
3.2 V
10 V
4.5 V
T
J
= 125°C
T
J
= 55°C T
J
= 25°C
V
DS
10 V
0.08
0.20
I
D
= 2.9 A
T
J
= 25°C
R
DS(on)
, DRAINTOSOURCE RESISTANCE (W)
0.08
T
J
= 25°C
V
GS
= 4.5 V
I
D
= 2.9 A
V
GS
= 4.5 V
150
60
V
GS
= 0 V
T
J
= 125°C
T
J
= 150°C
3.0
2.8 V
T
J
= 25°C
1.4 2.4 3.4
6.0 7.0 8.0 9.0 6.0
V
GS
= 10 V
0.12
0.14
0.16
0.18
1.6
1.8

NTGS5120PT1G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET PFET TSOP6 60V 2.5A 110mOhm
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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