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TLP2166A(TP,F)

P1-P3P4-P6P7-P9P10-P11
TLP2166A
2014-09-22
4
Switching Characteristics
(Unless otherwise specified, Ta=-40 to 100℃､V
CC
=3.0 to 3.6 V)(Each Channel)
Characteristic Symbol
Tes t
Circuit
Condition Min Typ. Max Unit
Propagation Delay Time
to Logic Low output
t
pHL
5
I
F
=0→7.5 mA
R
IN
=100 Ω
C
L
=15 pF
(Note 6)
― ― 75 ns
Propagation Delay Time
to Logic High output
t
pLH
I
F
=7.5→0 mA ― ― 75 ns
Switching Time Dispersion
between ON and OFF
|t
pHL
-t
pLH
|
I
F
=7.5 mA, R
IN
=100Ω, C
L
=15 pF
(Note 6)
― ― 45 ns
Fall Time (90 – 10 %) t
f
I
F
=0→7.5 mA
R
IN
=100 Ω
C
L
=15 pF
(Note 6)
― 5 ― ns
Rise Time (10 – 90 %) t
r
I
F
=7.5→0 mA
― 5 ― ns
Common Mode transient
Immunity at High Level Output
CM
H
6
V
CM
=1000 V
p-p
, I
F
=0 mA,
V
O
(min)=2 V, Ta=25°C
15000
― ― V/μs
Common Mode transient
Immunity at Low Level Output
CM
L
V
CM
=1000 V
p-p
, I
F
=7.5 mA,
V
O
(max)=0.6 V, Ta=25°C
-15000
― ― V/μs
*All typical values are at Ta=25°C, V
CC
=3.3 V.
Note 6: C
L
is approximately 15 pF which includes probe and jig/stray wiring capacitance.
TEST CIRCUIT 1: V
OL
Test Circuit TEST CIRCUIT 2: V
OH
Test Circuit
TEST CIRCUIT 3: I
CCL
Test Circuit TEST CIRCUIT 4: I
CCH
Test Circuit
V
CC
I
F
V
CC
GND
SHIELD
1
3
4
2
6
7
8
5
V
0.1 μF
V
OL
I
O
1
3
4
2
V
CC
GND
SHIELD
6
7
8
5
V
V
CC
0.1 μF
V
O
I
O
V
F
1
3
6
7
8
V
CC
GND
SHIELD
5 4
2
A
I
F1
I
F2
V
CC
0.1 μF
I
CCL
1
3 6
7
8
V
CC
GND
SHIELD
5
4
2
A
V
CC
0.1 μF
I
CCH
TLP2166A
2014-09-22
5
TEST CIRCUIT 5: Switching Time Test Circuit
TEST CIRCUIT 6: Common-Mode Transient Immunity Test Circuit
1
3
6
7
8
V
CC
GND
SHIELD
5
4
2
＋
－
SW
B
→
V
CC
V
CM
V
O
0.1 μF
I
F
P.G.: Pulse generator
C
L
includes probe and stray capacitance.
0.1 μF
I
F
monitor
C
L
=15 pF
C
L
1
3 6
7
8
V
CC
GND
SHIELD
5
4
2
V
CC
V
O
R
IN
=100 Ω
I
F
=7.5 mA(P.G)
(f=5 MHz, duty=50%)
V
OH
V
OL
t
pLH
t
pHL
1.5 V
50%
t
f
t
r
90%
10%
I
F
V
CM
10%
90%
1000 V
・SW B: I
F
=0 mA
・SW A: I
F
=7.5 mA
0.6 V
2 V
V
O
t
r
t
f
CM
L
CM
H
)(
)(800
str
V
CM
H
μ
=
)(
)(800
stf
V
CM
L
μ
=
TLP2166A
2014-09-22
6
Specification for Embossed–Tape Packing (TP) for SO8 Coupler
1. Applicable Package
Package Product Type
SO8 Photocoupler
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
(Example)
3. Tape Dimensions
3.1 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Figure 1 Device Orientation
3.2 Tape Packing Quantity:2500 devices per reel
3.3 Empty Device Recesses Are as Shown in Table 1.
Table 1 Empty Device Recesses
Standard Remarks
Occurrences of 2 or more
successive empty device
recesses
0
Within any given 40-mm section of
tape, not including leader and trailer
Single empty device
recesses
6 devices (max) per reel Not including leader and trailer
3.4 Start and End of Tape
The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty turns
only for a cover tape.
TLP2166A (TP)
Device name
Tape type
P1-P3P4-P6P7-P9P10-P11

TLP2166A(TP,F)

Mfr. #:
Buy TLP2166A(TP,F)
Manufacturer:
Toshiba
Description:
High Speed Optocouplers IC, Dual CH Dual Photocoupler
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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