MC74HCT241ADTG

© Semiconductor Components Industries, LLC, 2009
December, 2009 Rev. 8
1 Publication Order Number:
MC74HCT241A/D
MC74HCT241A
Octal 3-State Noninverting
Buffer/Line Driver/
Line Receiver with
LSTTL-Compatible Inputs
HighPerformance SiliconGate CMOS
The MC74HCT241A is identical in pinout to the LS241. This
device may be used as a level converter for interfacing TTL or NMOS
outputs to HighSpeed CMOS inputs. The HCT241A is an octal
noninverting buffer/line driver/line receiver designed to be used with
3state memory address drivers, clock drivers, and other busoriented
systems. The device has noninverted outputs and two output enables.
Enable A is activelow and Enable B is activehigh.
The HCT241A is similar in function to the HCT244. See also
HCT240.
Features
Output Drive Capability: 15 LSTTL Loads
TTL/NMOS Compatible Input Levels
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 4.5 to 5.5 V
Low Input Current: 1.0 mA
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
Chip Complexity: 118 FETs or 29.5 Equivalent Gates
PbFree Packages are Available*
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
http://onsemi.com
SOIC20W
DW SUFFIX
CASE 751D
TSSOP20
DT SUFFIX
CASE 948E
1
1
PDIP20
N SUFFIX
CASE 738
1
See detailed ordering, shipping information, and marking
information in the package dimensions section on page 6 of
this data sheet.
ORDERING INFORMATION
MC74HCT241A
http://onsemi.com
2
LOGIC DIAGRAM
DATA INPUTS
A1
A2
A3
A4
B1
B2
B3
B4
17
15
13
11
8
6
4
218
16
14
12
9
7
5
3
YB4
YB3
YB2
YB1
YA4
YA3
YA2
YA1
NONINVERTING
OUTPUTS
PIN 20 = V
CC
PIN 10 = GND
OUTPUT
ENABLES
ENABLE A
ENABLE B
1
19
PIN ASSIGNMENT
A3
A2
YB4
A1
ENABLE A
GND
YB1
A4
YB2
YB3 5
4
3
2
1
10
9
8
7
6
14
15
16
17
18
19
20
11
12
13
YA2
B4
YA1
ENABLE B
V
CC
B1
YA4
B2
YA3
B3
FUNCTION TABLE
Inputs Output
Enable A A YA
LLL
LHH
HXZ
Inputs Output
Enable B B YB
HLL
HHH
LXZ
Z = high impedance
X = don’t care
MC74HCT241A
http://onsemi.com
3
MAXIMUM RATINGS*
Symbol Parameter Value Unit
V
CC
DC Supply Voltage (Referenced to GND) – 0.5 to + 7.0 V
V
in
DC Input Voltage (Referenced to GND) – 0.5 to V
CC
+ 0.5 V
V
out
DC Output Voltage (Referenced to GND) – 0.5 to V
CC
+ 0.5 V
I
in
DC Input Current, per Pin ± 20 mA
I
out
DC Output Current, per Pin ± 35 mA
I
CC
DC Supply Current, V
CC
and GND Pins ± 75 mA
P
D
Power Dissipation in Still Air, Plastic or Ceramic DIP†
SOIC Package†
750
500
mW
T
stg
Storage Temperature – 65 to + 150
_C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
(Ceramic DIP)
260
300
_C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
Derating Plastic DIP: – 10 mW/_C from 65_ to 125_C
Ceramic DIP: – 10 mW/_C from 100_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
V
CC
DC Supply Voltage (Referenced to GND) 4.5 5.5 V
V
in
, V
out
DC Input Voltage, Output Voltage (Referenced to GND) 0 V
CC
V
T
A
Operating Temperature, All Package Types – 55 + 125
_C
t
r
, t
f
Input Rise and Fall Time (Figure 1) 0 500 ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Symbol
Parameter Test Conditions
V
CC
V
Guaranteed Limit
Unit
– 55 to
25_C
v 85_C v 125_C
V
IH
Minimum HighLevel Input
Voltage
V
out
= 0.1 V or V
CC
– 0.1 V
|I
out
| v 20 μA
4.5
5.5
2
2
2
2
2
2
V
V
IL
Maximum LowLevel Input
Voltage
V
out
= 0.1 V or V
CC
– 0.1 V
|I
out
| v 20 μA
4.5
5.5
0.8
0.8
0.8
0.8
0 8
0.8
V
V
OH
Minimum HighLevel Output
Voltage
V
in
= V
IH
or V
IL
|I
out
| v 20 μA
4.5
5.5
4.4
5.4
4.4
5.4
4.4
5.4
V
V
in
= V
IH
or V
IL
|I
out
| v 6 mA 4.5 3.98 3.84 3.7
V
OL
Maximum LowLevel Output
Voltage
V
in
= V
IH
or V
IL
|I
out
| v 20 μA
4.5
5.5
0.1
0.1
0.1
0.1
0.1
0.1
V
V
in
= V
IH
or V
IL
|I
out
| v 6 mA 4.5 0.26 0.33 0.4
I
in
Maximum Input Leakage Current V
in
= V
CC
or GND 5.5 ± 0.1 ± 1.0 ± 1.0 μA
I
OZ
Maximum ThreeState
Leakage Current
Output in HighImpedance State
V
in
= V
IL
or V
IH
V
out
= V
CC
or GND
5.5 ± 0.5 ± 5.0 ± 10 μA
I
CC
Maximum Quiescent Supply
Current (per Package)
V
in
= V
CC
or GND
I
out
= 0 μA
5.5 4 40 160 μA
ΔI
CC
Additional Quiescent Supply
Current
V
in
= 2.4 V, Any One Input
V
in
= V
CC
or GND, Other Inputs
l
out
= 0 μA
5.5
55_C 25_C to 125_C
mA
2.9 2.4
1. Total Supply Current = I
CC
+ ΣΔI
CC
.
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this highimpedance cir-
cuit. For proper operation, V
in
and
V
out
should be constrained to the
range GND v (V
in
or V
out
) v V
CC
.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or V
CC
).
Unused outputs must be left open.

MC74HCT241ADTG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Buffers & Line Drivers BUFFRNONINVRT3-ST/ LN DR
Lifecycle:
New from this manufacturer.
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