Features
z Guard Ring Construction for Transient Protection
z Low Reverse Capacitance
z Low Forward Voltage Drop and Low Reverse Recovery Time
z Lead Free Finish/RoHS Compliant(Note 1) ("P" Suffix designates
Mechanical Data
z Case: MiniMELF, Glass
z Terminals: Solderable per MIL -STD-202, Method 208
z Polarity: Indicated by Cathode Band
z Weight: 0.05 grams ( approx.)
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Characteristic Symbol LLSD101A LLSD101B LLSD101C
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blockin
Volta
e
V
RRM
VRWM
VR
60V 50V 40V
RMS Reverse Voltage V
R(RMS) 42V 35V 28V
Forward Continuous Current(Note 2)
I
FM 15mA
Non-Repetitive Peak @ t<=1.0s
Forward Surge Current @ t=10us
I
FSM
50mA
2.0A
Power Dissipation(Note 2) Pd 400mW
Thermal Resistance(Note 2) R 375K/W
Operation & Storage Temp. Range Tj, T
STG -55 to 150
o
C
Electrical Characteristics @ 25
o
C Unless Otherwise Specified
Charateristic Symbol Min Max Unit Test Cond.
Peak LLSD101A V
R
=50V
Reverse LLSD101B I
RM -----
200 nA V
R
=40V
Current LLSD101C V
R
=30V
LLSD101A 0.41 I
F
=1.0mA
LLSD101B 0.40 I
F
=1.0mA
Forward LLSD101C V
FM
-----
0.39 V I
F
=1.0mA
Volt. Drop LLSD101A 1.00 I
F
=15mA
LLSD101B 0.95 I
F
=15mA
LLSD101C 0.90 I
F
=15mA
Junction LLSD101A 2.0
Capacitance LLSD101B Cj
-----
2.1 pF V
R
=0V, f=1.0MHz
LLSD101C 2.2
Reverse Recovery Time
t
rr
-----
1.0 ns
I
F
=I
R
=5mA,
recover to 0.1 I
R
2.Valid provided that electrodes are kept at ambient temperature
LLSD101A
THRU
LLSD101C
Schottky Barrier
Switching Diode
DIMENSION
INCHES MM DIM
MIN M A X MIN M A X
NOTE
A .134 .142 3.40 3.60
B .008 .016 .20 .40
C .055 .059 1.40 1.50
MINIMELF
B
C
h
M
rk
0.030”
0.075”
SUGGESTED SOLDER
PAD LAYOUT
omponents
20736 Marilla Street Chatsworth
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MCC
Revision: 5 2008/01/01
TM
Micro Commercial Components
www.mccsemi.com
1 of 3
Note:1.Lead in Glass Exemption Applied, see EU Directive Annex 5.
Compliant. See ordering information)
