ENGINEERING PRODUCT
SPECIFICATION
DATE ISSUED: 12/07/2011 CCS-11005 Page 8 of 10
SUBJECT / TITLE : UNIVERSAL CONTACT Z SERIES
6.2 Durability---Mating Cycles: 100 min. Up to and over 500 cycles may be achieved
depending on mating surface. Maximum mating cycle based on
mating PCB plated with 0.05µ Au over 2.0µ Ni = 500 cycles.
(Wear resistance is subject to mating component surface finish and plating type,
increased mating component plating spec = increased mating cycles.)
7 Electrical
7.1 Contact Resistance: Max 20 mΩ
7.2 Current:
Rating current : 1.50A
Max. continual current : 2.0 A
Peak current ：2.5 A
8 Environmental
8.1 Operating Temperature: Usable in temperatures between -40 and +85°C.
8.2 Humidity: Operable in 90% Relative Humidity (Temperature <40°C).
8.3 Lower Temperature : -57°C(24hours) followed by-51°C(48hours)
8.4 High temperature: +85°C(24hours) followed by 71°C(144hours)
8.3 Solder Systems: Suitable for lead free reflow soldering at 260°C. Max. 3 x reflow cycles
recommended. According to JEDEC Standard J-STD-020C
Hand Soldering
Wave line Soldering
Infrared Reflow Soldering
CCS11005 REVISION 2
5Hz to 9Hz @ 1.5mm pk Displacement
9Hz to 200Hz @ 0.5g pk Acceleration
1 Oct per minute; 1 Hour per axis. 3 Axis total.
6.3 Vibration---The test samples were subjected to the following vibration profile:
100g pk Acceleration
11ms duration
3 shocks in each axis
6 directions
6.4 Shock ---The test samples were subjected to the following shock:
