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LT1057ACN8#PBF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
LT1057/LT1058
13
10578fd
TYPICAL APPLICATIONS
Instrumentation Amplifier with Shield Driver
100dB Range Logarithmic Photodiode Amplifier
–
+
–
+
–
+
–
+
+
–
10578 TA09
1/4
LT1058
1/4
LT1058
1/4
LT1058
1/4
LT1058
R
F
9.1k
R
G
1k
15V
–15V
11
OUTPUT
GAIN = 10(1+R
F
/R
G
) ≈ 100
I
B
= 5pA
R
IN
= 10
12
Ω
BW = 350kHz
7
10
9
4
5
6
3
1
8
GUARD
INPUT
GUARD
2
13
12
14
R
G
1k
R
F
9.1k
1k
1k
10k
10k
+
–
+
–
10578 TA10
1/2
LT1057
1/2
LT1057
–
+
LM301A
50k*
10k*
OUT
IN
15V
2k
15
13
14
33Ω
7
8
9
15V
LIGHT (900µM)
1MW
100µW
10µW
1µW
100nW
10nW
CIRCUIT OUTPUT
10.0V
7.85V
5.70V
3.55V
1.40V
–0.75V
RESPONSE DATA
DIODE CURRENT
350µA
35µA
3.5µA
350nA
35nA
3.5nA
2k
I
P
750k*
E
OUT
1M
1M
FULL-SCALE
TRIM
50k
DARK
TRIM
10k*
LT1021-10V
3k
Q5
10
12
11
6 Q4
500pF
4
5
0.01µF
0.033µF
Q2
32
1
Q3
Q1
= HP-5082-4204 PIN PHOTODIODE.
Q1–Q5 = CA3096.
CONNECT SUBSTRATE OF CA3096
ARRAY TO Q4’s EMITTER.
*1% RESISTOR
100dB RANGE LOGARITHMIC PHOTODIODE AMPLIFIER
LT1057/LT1058
14
10578fd
.050
(1.270)
MAX
.016 – .021**
(0.406 – 0.533)
.010 – .045*
(0.254 – 1.143)
SEATING
PLANE
.040
(1.016)
MAX
.165 – .185
(4.191 – 4.699)
GAUGE
PLANE
REFERENCE
PLANE
.500 – .750
(12.700 – 19.050)
.305 – .335
(7.747 – 8.509)
.335 – .370
(8.509 – 9.398)
DIA
.200
(5.080)
TYP
.027 – .045
(0.686 – 1.143)
.028 – .034
(0.711 – 0.864)
.110 – .160
(2.794 – 4.064)
INSULATING
STANDOFF
45°TYP
H8(TO-5) 0.200 PCD 0801
LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND THE SEATING PLANE
FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS
.016 – .024
(0.406 – 0.610)
*
**
PIN 1
J8 0801
.014 – .026
(0.360 – 0.660)
.015 – .060
(0.381 – 1.524)
.125
3.175
MIN
.100
(2.54)
BSC
.300 BSC
(7.62 BSC)
.008 – .018
(0.203 – 0.457)
0° – 15°
.045 – .065
(1.143 – 1.651)
.045 – .068
(1.143 – 1.650)
FULL LEAD
OPTION
.023 – .045
(0.584 – 1.143)
HALF LEAD
OPTION
CORNER LEADS OPTION
(4 PLCS)
.200
(5.080)
MAX
.005
(0.127)
MIN
.405
(10.287)
MAX
.220 – .310
(5.588 – 7.874)
1 2
3
4
8 7
6 5
.025
(0.635)
RAD TYP
NOTE: LEAD DIMENSIONS APPLY TO SOLDER
DIP/PLATE OR TIN PLATE LEADS
.300 BSC
(7.62 BSC)
.008 – .018
(0.203 – 0.457)
0
° – 15°
J14 0801
.045 – .065
(1.143 – 1.651)
.100
(2.54)
BSC
.014 – .026
(0.360 – 0.660)
.200
(5.080)
MAX
.015 – .060
(0.381 – 1.524)
.125
(3.175)
MIN
NOTE: LEAD DIMENSIONS APPLY
TO SOLDER DIP/PLATE OR TIN
PLATE LEADS
1
2 3 4
5 6
7
.220 – .310
(5.588 – 7.874)
.785
(19.939)
MAX
.005
(0.127)
MIN
14
11 891013
12
.025
(0.635)
RAD TYP
PACKAGE DESCRIPTION
H Package
8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320)
J8 Package
8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
J Package
14-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
OBSOLETE PACKAGES
LT1057/LT1058
15
10578fd
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
1 2
3
4
8 7 6
5
.255 ±.015*
(6.477 ±0.381)
.400*
(10.160)
MAX
.008 – .015
(0.203 – 0.381)
.300 – .325
(7.620 – 8.255)
.325
+.035
–.015
+0.889
–0.381
8.255
( )
NOTE:
1. DIMENSIONS ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
N8 REV I 0711
.065
(1.651)
TYP
.045 – .065
(1.143 – 1.651)
.130 ±.005
(3.302 ±0.127)
.020
(0.508)
MIN
.018 ±.003
(0.457 ±0.076)
.120
(3.048)
MIN
.100
(2.54)
BSC
N Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510 Rev I)
.008 – .015
(0.203 – 0.381)
.300 – .325
(7.620 – 8.255)
.325
+.035
–.015
+0.889
–0.381
8.255
( )
.255 ±.015*
(6.477 ±0.381)
.770*
(19.558)
MAX
31
2
4
5
6
7
8910
11
1213
14
NOTE:
1. DIMENSIONS ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
N14 REV I 0711
.020
(0.508)
MIN
.120
(3.048)
MIN
.130 ±.005
(3.302 ±0.127)
.045 – .065
(1.143 – 1.651)
.065
(1.651)
TYP
.018 ±.003
(0.457 ±0.076)
.005
(0.127)
MIN
.100
(2.54)
BSC
N Package
14-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510 Rev I)
SO8 REV G 0212
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
× 45°
0°– 8° TYP
.008 – .010
(0.203 – 0.254)
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
1
2
3
4
.150 – .157
(3.810 – 3.988)
NOTE 3
8
7
6
5
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.245
MIN
.160 ±.005
RECOMMENDED SOLDER PAD LAYOUT
.045 ±.005
.050 BSC
.030 ±.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
4. PIN 1 CAN BE BEVEL EDGE OR A DIMPLE
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610 Rev G)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

LT1057ACN8#PBF

Mfr. #:
Buy LT1057ACN8#PBF
Manufacturer:
Analog Devices / Linear Technology
Description:
High Speed Operational Amplifiers 2x JFET In Prec Hi Speed Op Amps
Lifecycle:
New from this manufacturer.
Delivery:
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