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NLU3G16CMX1TCG

P1-P3P4-P6P7-P9
NLU3G16
www.onsemi.com
4
SWITCHING WAVEFORMS
Figure 3. Switching Waveforms
Y
*Includes all probe and jig capacitance
C
L
*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
Figure 4. Test Circuit
50%
50% V
CC
V
CC
GND
t
PLH
t
PHL
A
ORDERING INFORMATION
Device Package Shipping
†
NLU3G16MUTAG UDFN8
(Pb−Free)
3000 / Tape & Reel
NLU3G16AMX1TCG ULLGA8, 1.95 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLU3G16DMUTCG UDFN8, 1.95 x 1
(Pb−Free)
3000 / Tape & Reel
NLU3G16EMUTCG UDFN8, 1.6 x 1
(Pb−Free)
3000 / Tape & Reel
NLU3G16FMUTCG UDFN8, 1.45 x 1
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NLU3G16
www.onsemi.com
5
PACKAGE DIMENSIONS
UDFN8 1.8x1.2, 0.4P
CASE 517AJ
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 mm FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH MAY
NOT EXCEED 0.03 ONTO BOTTOM
SURFACE OF TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
A B
E
D
BOTTOM VIEW
b
e
8X
BAC
C
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10
C
A
A1
(A3)
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L
8X
1
4
58
DIM MIN MAX
MILLIMETERS
A 0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b 0.15 0.25
D 1.80 BSC
E 1.20 BSC
e 0.40 BSC
L 0.45 0.55
e/2
b2 0.30 REF
L1 0.00 0.03
L2 0.40 REF
DETAIL A
(L2)
(b2)
NOTE 5
L1
DETAIL A
M
0.10
M
0.05
0.22
0.32
8X
1.50
0.40 PITCH
0.66
DIMENSIONS: MILLIMETERS
MOUNTING FOOTPRINT
7X
1
SOLDERMASK DEFINED
NLU3G16
www.onsemi.com
6
PACKAGE DIMENSIONS
UDFN8, 1.6x1, 0.4P
CASE 517BY
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
DIM MIN MAX
MILLIMETERS
A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b 0.15 0.25
D 1.60 BSC
E 1.00 BSC
e 0.40 BSC
L 0.25 0.35
L1 0.30 0.40
A B
E
D
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10
C
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
2X
2X
A3
BOTTOM VIEW
b
e
8X
L7X
L1
1
4
58
e/2
0.10 B
0.05
AC
C
NOTE 3
M
M
DIMENSIONS: MILLIMETERS
0.26
7X
0.49
8X
1.24
0.53
PITCH
0.40
1
PKG
OUTLINE
P1-P3P4-P6P7-P9

NLU3G16CMX1TCG

Mfr. #:
Buy NLU3G16CMX1TCG
Manufacturer:
ON Semiconductor
Description:
Buffers & Line Drivers TRIPLE BUFFER
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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