PSMN030-150P All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 16 December 2010 6 of 13
NXP Semiconductors
PSMN030-150P
N-channel TrenchMOS SiliconMAX standard level FET
6. Characteristics
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
drain-source breakdown
voltage
I
D
=0.25mA; V
GS
=0V; T
j
= -55 °C 133 - - V
I
D
=0.25mA; V
GS
=0V; T
j
= 25 °C 150 - - V
V
GS(th)
gate-source threshold voltage I
D
=1mA; V
DS
=V
GS
; T
j
=-55°C --6V
I
D
=1mA; V
DS
=V
GS
; T
j
=25°C 234V
I
D
=1mA; V
DS
=V
GS
; T
j
= 175 °C 1 - - V
I
DSS
drain leakage current V
DS
=150V; V
GS
=0V; T
j
= 25 °C - 0.05 10 µA
V
DS
=150V; V
GS
=0V; T
j
= 175 °C - - 500 µA
I
GSS
gate leakage current V
GS
=10V; V
DS
=0V; T
j
= 25 °C - 2 100 nA
V
GS
=-10V; V
DS
=0V; T
j
= 25 °C - 2 100 nA
R
DSon
drain-source on-state
resistance
V
GS
=10V; I
D
=25A; T
j
= 175 °C - - 81 mΩ
V
GS
=10V; I
D
=25A; T
j
= 25 °C - 24 30 mΩ
Dynamic characteristics
Q
G(tot)
total gate charge I
D
=55.5A; V
DS
=120V;
V
GS
=10V; T
j
=25°C
-98-nC
Q
GS
gate-source charge - 16 - nC
Q
GD
gate-drain charge - 38 50 nC
C
iss
input capacitance V
DS
=25V; V
GS
= 0 V; f = 1 MHz;
T
j
=25°C
- 3680 - pF
C
oss
output capacitance - 470 - pF
C
rss
reverse transfer capacitance - 220 - pF
t
d(on)
turn-on delay time V
DS
=75V; R
L
=1.5Ω; V
GS
=10V;
R
G(ext)
=5.6Ω; T
j
=25°C
-18-ns
t
r
rise time - 71 - ns
t
d(off)
turn-off delay time - 97 - ns
t
f
fall time - 76 - ns
L
D
internal drain inductance measured from tab to centre of die ;
T
j
=25°C
-3.5-nH
measured from drain lead to centre of
die (SOT78 package only) ;
T
j
=25°C
-4.5-nH
L
S
internal source inductance measured from source lead to source
bond pad ; T
j
=25°C
-7.5-nH
Source-drain diode
V
SD
source-drain voltage I
S
=25A; V
GS
=0V; T
j
= 25 °C - 0.85 1.2 V
t
rr
reverse recovery time I
S
=20A; dI
S
/dt = -100 A/µs;
V
GS
=0V; V
DS
=30V; T
j
=25°C
- 109 - ns
Q
r
recovered charge - 610 - nC