MC74LCX257DTR2

MC74LCX257
http://onsemi.com
4
DC ELECTRICAL CHARACTERISTICS
T
A
= −40°C to +85°C
Symbol Characteristic Condition Min Max Unit
V
IH
HIGH Level Input Voltage (Note 2) 2.3 V V
CC
2.7 V 1.7 V
2.7 V V
CC
3.6 V 2.0
V
IL
LOW Level Input Voltage (Note 2) 2.3 V V
CC
2.7 V 0.7 V
2.7 V V
CC
3.6 V 0.8
V
OH
HIGH Level Output Voltage 2.3 V V
CC
3.6 V; I
OH
= −100 A V
CC
0.2 V
V
CC
= 2.3 V; I
OH
= −8 mA 1.8
V
CC
= 2.7 V; I
OH
= −12 mA 2.2
V
CC
= 3.0 V; I
OH
= −18 mA 2.4
V
CC
= 3.0 V; I
OH
= −24 mA 2.2
V
OL
LOW Level Output Voltage 2.3 V V
CC
3.6 V; I
OL
= 100 A 0.2 V
V
CC
= 2.3 V; I
OL
= 8 mA 0.6
V
CC
= 2.7 V; I
OL
= 12 mA 0.4
V
CC
= 3.0 V; I
OL
= 16 mA 0.4
V
CC
= 3.0 V; I
OL
= 24 mA 0.55
I
I
Input Leakage Current 2.3 V V
CC
3.6 V; 0 V V
I
5.5 V ±5 A
I
OZ
3−State Output Current 2.3 V
CC
3.6 V; 0 V V
O
5.5 V;
V
I
= V
IH
or V
IL
±5 A
I
OFF
Power−Off Leakage Current V
CC
= 0 V; V
I
or V
O
= 5.5 V 10 A
I
CC
Quiescent Supply Current 2.3 V
CC
3.6 V; V
I
= GND or V
CC
10 A
2.3 V
CC
3.6 V; 3.6 V
I
or V
O
5.5 V ±10
I
CC
Increase in I
CC
per Input 2.3 V
CC
3.6 V; V
IH
= V
CC
− 0.6 V 500 A
2. These values of V
I
are used to test DC electrical characteristics only.
AC CHARACTERISTICS t
R
= t
F
= 2.5 ns; R
L
= 500
Limits
T
A
= −40°C to +85°C
V
CC
= 3.3 V ± 0.3 V V
CC
= 2.7 V V
CC
= 2.5 V ± 0.2 V
C
L
= 50 pF C
L
= 50 pF C
L
= 30 pF
Symbol Parameter Waveform Min Max Min Max Min Max Unit
t
PLH
Propagation Delay 1 1.5 6.0 1.5 6.5 1.5 7.2 ns
t
PHL
In to Zn 1.5 6.0 1.5 6.5 1.5 7.2
t
PLH
Propagation Delay 1, 2 1.5 7.0 1.5 8.5 1.5 9.1 ns
t
PHL
S to Zn 1.5 7.0 1.5 8.5 1.5 9.1
t
PZH
Output Enable Time to 3 1.5 7.0 1.5 8.5 1.5 9.1 ns
t
PZL
High and Low Level 1.5 7.0 1.5 8.5 1.5 9.1
t
PHZ
Output Disable Time From 3 1.5 5.5 1.5 6.0 1.5 6.6 ns
t
PLZ
High and Low Level 1.5 5.5 1.5 6.0 1.5 6.6
t
OSHL
Output−to−Output Skew 1.0 ns
t
OSLH
(Note 3) 1.0
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (t
OSHL
) or LOW−to−HIGH (t
OSLH
); parameter
guaranteed by design.
MC74LCX257
http://onsemi.com
5
DYNAMIC SWITCHING CHARACTERISTICS
T
A
= +25°C
Symbol Characteristic Condition Min Typ Max Unit
V
OLP
Dynamic LOW Peak Voltage V
CC
= 3.3 V, C
L
= 50 pF, V
IH
= 3.3 V, V
IL
= 0 V 0.8 V
(Note 4) V
CC
= 2.5 V, C
L
= 30 pF, V
IH
= 2.5 V, V
IL
= 0 V 0.6 V
V
OLV
Dynamic LOW Valley Voltage V
CC
= 3.3 V, C
L
= 50 pF, V
IH
= 3.3 V, V
IL
= 0 V −0.8 V
(Note 4) V
CC
= 2.5 V, C
L
= 30 pF, V
IH
= 2.5 V, V
IL
= 0 V −0.6 V
4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Unit
C
IN
Input Capacitance V
CC
= 3.3 V, V
I
= 0 V or V
CC
7 pF
C
I/O
Input/Output Capacitance V
CC
= 3.3 V, V
I
= 0 V or V
CC
8 pF
C
PD
Power Dissipation Capacitance 10 MHz, V
CC
= 3.3 V, V
I
= 0 V or V
CC
25 pF
WAVEFORM 1 − NON−INVERTING PROPAGATION DELAYS
t
R
= t
F
= 2.5 ns, 10% to 90%; f = 1.0 MHz; t
W
= 500 ns
V
CC
0 V
V
OH
V
OL
In, S
Zn
t
PHL
t
PLH
WAVEFORM 3 − OUTPUT ENABLE AND DISABLE TIMES
t
R
= t
F
= 2.5 ns, 10% to 90%; f = 1.0 MHz; t
W
= 500 ns
V
CC
0 V
0 V
OE
Zn
t
PZH
3.0V
t
PHZ
t
PZL
t
PLZ
Zn
Vmo
Vmo
VmiVmi
Vmo Vmo
Vmi
V
CC
V
OH
− 0.3
V
V
OL
+ 0.3 V
GND
Vmi
WAVEFORM 2 − INVERTING PROPAGATION DELAYS
t
R
= t
F
= 2.5 ns, 10% to 90%; f = 1.0 MHz; t
W
= 500 ns
V
C
C
0 V
V
OH
V
O
L
S
Zn
t
PHL
t
PLH
VmiVmi
Vmo Vmo
Vcc
Symbol 3.3 V + 0.3 V 2.7 V 2.5 V + 0.2 V
Vmi 1.5 V 1.5 V Vcc/2
Vmo 1.5 V 1.5 V Vcc/2
V
HZ
V
OL
+ 0.3 V V
OL
+ 0.3 V V
OL
+ 0.15 V
V
LZ
V
OH
− 0.3 V V
OH
− 0.3 V V
OH
− 0.15 V
Figure 3. AC Waveforms
MC74LCX257
http://onsemi.com
6
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
R
X 45
G
8 PLP
−B−
−A−
M
0.25 (0.010) B
S
−T−
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019

TSSOP−16
DT SUFFIX
CASE 948F−01
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.

SECTION N−N
SEATING
PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
DETAIL E
F
M
L
2X L/2
−U−
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
0.10 (0.004)
−T−
−V−
−W−
0.25 (0.010)
16X REFK
N
N

MC74LCX257DTR2

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC MUX QUAD 2INP HP 3ST 16-TSSOP
Lifecycle:
New from this manufacturer.
Delivery:
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