ADM1021A
http://onsemi.com
16
PACKAGE DIMENSIONS
QSOP16
CASE 492−01
ISSUE A
E
M
0.25 C
A1
A2
C
DETAIL A
DETAIL A
h x 45
_
DIM MAXMIN
INCHES
A 0.053 0.069
b 0.008 0.012
L 0.016 0.050
e 0.025 BSC
h 0.009 0.020
c 0.007 0.010
A1 0.004 0.010
M 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION.
4. DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH,
PROTRUSIONS, OR GATE BURRS SHALL NOT EX
CEED 0.005 PER SIDE. DIMENSION E1 DOES NOT
INCLUDE INTERLEAD FLASH OR PROTRUSION. IN
TERLEAD FLASH OR PROTRUSION SHALL NOT EX
CEED 0.005 PER SIDE. D AND E1 ARE DETERMINED
AT DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
__
b
L
6.40
16X
0.42
16X
1.12
0.635
DIMENSIONS: MILLIMETERS
16
PITCH
SOLDERING FOOTPRINT*
9
18
D
D
16X
SEATING
PLANE
0.10 C
E1
A
A-B D
0.20
C
e
18
16 9
16X
C
M
D 0.193 BSC
E 0.237 BSC
E1 0.154 BSC
L2 0.010 BSC
D
0.25
C D
B
0.20 C D
2X
2X
2X 10 TIPS
0.10 C
H
GAUGE
PLANE
C
A2 0.049 ----
1.35 1.75
0.20 0.30
0.40 1.27
0.635 BSC
0.22 0.50
0.19 0.25
0.10 0.25
0 8
__
4.89 BSC
6.00 BSC
3.90 BSC
0.25 BSC
1.24 ----
MAXMIN
MILLIMETERS
L2
A
SEATING
PLANE
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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