STD5N20L
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Table 3: Absolute Maximum ratings
( ) Pulse width limited by safe operating area
Table 4: Thermal Data
ELECTRICAL CHARACTERISTICS (T
CASE
=25°C UNLESS OTHERWISE SPECIFIED)
Table 5: On/Off
Symbol Parameter Value Unit
V
DS
Drain-source Voltage (V
GS
= 0)
200 V
V
DGR
Drain-gate Voltage (R
GS
= 20 kΩ)
200 V
V
GS
Gate- source Voltage ±20 V
I
D
Drain Current (continuous) at T
C
= 25°C
5A
I
D
Drain Current (continuous) at T
C
= 100°C
3.6 A
I
DM
( )
Drain Current (pulsed) 20 A
P
TOT
Total Dissipation at T
C
= 25°C
33 W
Derating Factor 0.27 W/°C
T
stg
Storage Temperature
–55 to 150 °C
T
j
Operating Junction Temperature
Rthj-case Thermal Resistance Junction-case Max 3.75 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 100 °C/W
T
l
Maximum Lead Temperature For Soldering Purpose 275 °C
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
Breakdown Voltage
I
D
= 250 µA, V
GS
= 0 200 V
I
DSS
Zero Gate Voltage
Drain Current (V
GS
= 0)
V
DS
= Max Rating
1µA
V
DS
= Max Rating, T
C
= 125°C
10 µA
I
GSS
Gate-body Leakage
Current (V
DS
= 0)
V
GS
= ±20V ±100 nA
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
, I
D
= 50µA
12.5V
R
DS(on)
Static Drain-source On
Resistance
V
GS
= 5 V, I
D
= 2.5 A 0.65 0.7 Ω
