TLVB4200
www.vishay.com
Vishay Semiconductors
Rev. 1.9, 14-Oct-14
1
Document Number: 83135
For technical questions, contact: LED@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Backlighting Blue LED, Ø 3 mm Tinted Non-Diffused Package
DESCRIPTION
The TLVB4200 series was developed for backlighting. Due
to its special shape the spatial distribution of the radiation is
qualified for backlighting.
To optimize the brightness of backlighting a custom-built
reflector (with scattering) is required. Uniform illumination
can be enhanced by covering the front of the reflector with
diffusor material.
This is a flexible solution for backlighting different areas.
PRODUCT GROUP AND PACKAGE DATA
• Product group: LED
• Package: 3 mm backlighting
• Product series: standard
• Angle of half intensity: ± 85°
FEATURES
• High light output
• Wide viewing angle (backlighting)
• Categorized for luminous flux
• Tinted clear package
• Low power dissipation
• Low self heating
• Rugged design
• High reliability
• ESD class 1
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Backlighting of display panels, LCD displays, symbols on
switches, keyboards, graphic boards and measuring
scales
• Illumination of large areas e.g. dot matrix displays
19231
PARTS TABLE
PART COLOR
LUMINOUS FLUX
(mlm)
at I
F
(mA)
WAVELENGTH
(nm)
at I
F
(mA)
FORWARD VOLTAGE
(V)
at I
F
(mA)
TECHNOLOGY
MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.
TLVB4200 Blue 25 38 - 15 - 466 - 10 - 3.9 4.5 20 GaN on SiC
ABSOLUTE MAXIMUM RATINGS (T
amb
= 25 °C, unless otherwise specified)
TLVB4200
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage V
R
5V
DC forward current T
amb
≤ 60 °C I
F
20 mA
Surge forward current t
p
≤ 10 μs I
FSM
0.1 A
Power dissipation T
amb
≤ 60 °C P
V
100 mW
Junction temperature T
j
100 °C
Operating temperature range T
amb
-40 to +100 °C
Storage temperature range T
stg
-40 to +100 °C
Soldering temperature t ≤ 5 s, 2 mm from body T
sd
260 °C
Thermal resistance junction/ambient R
thJA
400 K/W