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AT91M40800
9. Packaging Information
Figure 9-1. 100-lead LQFP Package Drawing
PIN 1
aaa
bbb
cc
1
ddd
θ2
θ3
S
L1
R1
R2
0.25
θ
ccc
θ
1
Table 9-1. Common Dimensions (mm)
Symbol Min Nom Max
c0.09 0.2
c1 0.09 0.16
L 0.45 0.6 0.75
L1 1.00 REF
R2 0.08 0.2
R1 0.08
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AT91M40800
S0.2
q0° 3.5° 7°
θ10°
θ2 11° 12° 13°
θ3 11° 12° 13°
A 1.6
A1 0.05 0.15
A2 1.35 1.4 1.45
Tolerances of form and position
aaa 0.2
bbb 0.2
Table 9-1. Common Dimensions (mm)
Table 9-2. Lead Count Dimensions (mm)
Pin
Count
D/E
BSC
D1/E1
BSC
bb1
e BSC ccc dddMin Nom Max Min Nom Max
100 16.0 14.0 0.17 0.22 0.27 0.17 0.2 0.23 0.50 0.10 0.06
Table 9-3. Device and 100-lead LQFP Package Maximum Weight
707 mg
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AT91M40800
10. Soldering Profile
Table 10-1 gives the recommended soldering profile from J-STD-020C.
Note: The package is certified to be backward compatible with Pb/Sn soldering profile.
A maximum of three reflow passes is allowed per component.
Table 10-1. Soldering Profile Green Compliant Package
Profile Feature Green Package
Average Ramp-up Rate (217°C to Peak) 3°C/sec. max.
Preheat Temperature 175°C ±25°C 180 sec. max.
Temperature Maintained Above 217°C 60 sec. to 150 sec.
Time within 5°C of Actual Peak Temperature 20 sec. to 40 sec.
Peak Temperature Range 260°C
Ramp-down Rate 6°C/sec. max.
Time 25°C to Peak Temperature 8 min. max.

AT91M40800-33AU

Mfr. #:
Manufacturer:
Microchip Technology / Atmel
Description:
ARM Microcontrollers - MCU 8K SRAM Ext Bus Interface IND TEMP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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