NCV8665
http://onsemi.com
2
PIN DESCRIPTIONS
Symbol Function
V
IN
Unregulated input voltage; 5.5 V to 45 V; Battery Input Voltage. Bypass to GND with a 0.1 mF ceramic capacitor.
R
O
Reset Output; open collector active Reset (Accurate when V
OUT
> 1.0 V)
GND Ground; Pin 3 internally connected to Tab
D Reset Delay; timing capacitor to GND for Reset Delay function
V
OUT
Output; ±2.0%, 150 mA. 10 mF, ESR < 16 W
ABSOLUTE MAXIMUM RATINGS
Pin Symbol, Parameter Symbol Min Max Unit
V
IN
, DC Input Voltage V
IN
−42 +45 V
V
OUT
, DC Voltage V
OUT
−0.3 +16 V
Reset Output Voltage V
RO
−0.3 25 V
Reset Output Current I
RO
−5.0 5.0 mA
Reset Delay Voltage V
D
−0.3 7.0 V
Reset Delay Current I
D
−2.0 2.0 mA
Storage Temperature T
STG
−55 +150 °C
ESD Capability, Human body Model (Note 1) V
ESDHB
4000 V
ESD Capability, Machine Model (Note 1) V
ESDMM
200 V
Moisture Sensitivity Level MSL 1 −
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model (HBM) tested per AEC−Q100−002 (EIA/JESD22−A 114C)
ESD Machine Model (MM) tested per AEC−Q100−003 (EIA/JESD22−A 115C)
2. Latchup Current Maximum Rating: ≤ 100 mA per JEDEC standard: JESD78.
OPERATING RANGE
Pin Symbol, Parameter Symbol Min Max Unit
Input Voltage Operating Range V
IN
5.5 45 V
Junction Temperature T
J
−40 150 °C
THERMAL RESISTANCE
Parameter Symbol Min Max Unit
Junction to Ambient (Note 3) D
2
PAK
R
q
JA
− 85.4
°C/W
Junction to Case (Note 3) D
2
PAK
R
q
JC
− 6.8
Junction to Ambient (Note 4) SOIC−8
R
q
JA
− 138
Junction to Lead 6 (Note 4) SOIC−8
Y
q
JL6
− 21
3. As mounted on a 35x35x1mm FR4 PCB with a single layer of 100 mm
2
of 1 oz copper heat spreading area.
4. As mounted on a 35x35x1mm FR4 PCB with a single layer of 100 mm
2
of 1 oz copper heat spreading area including traces directly connected
to the leads.
Pb SOLDERING TEMPERATURE AND MSL
Parameter Symbol Min Max Unit
Lead Temperature Soldering Reflow (SMD styles only), Pb−Free (Note 5) T
sld
− 265 pk °C
MSL, 8−Lead EP, LS Temperature 260°C MSL 1 −
5. This device series incorporates ESD protection and exceeds the following ratings:
Human Body Model (HBM) 2.0 kV per JEDEC standard: JESD22–A114.
Machine Model (MM) 200 V per JEDEC standard: JESD22–A115.
