LTC5549
16
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applicaTions inForMaTion
Enable Interface
Figure 9 shows a simplified schematic of the EN pin in-
terface. To enable
the chip, the EN voltage must be higher
than 1.2V. The voltage at the EN pin should never exceed
V
CC
by more than 0.3V. If this should occur, the supply
current could be sourced through the ESD diode, potentially
damaging the IC. If the EN pin is left floating, its voltage
will be pulled low by the internal pull-down resistor and
the chip will be disabled.
X2 Interface
Figure 10 shows a simplified schematic of the X2 pin
interface. To enable the integrated LO frequency doubler,
Figure 9. Simplified Enable Input Circuit Figure 10. Simplified X2 Interface Circuit
the X2 voltage must be higher than 1.2V. The X2 voltage
at the pin should never exceed V
CC
by more than 0.3V. If
this should occur, the supply current could be sourced
through the ESD diode, potentially damaging the IC. If the
X2 pin is left floating, its voltage will be pulled low by the
internal pull-down resistor and the LO frequency doubler
will be disabled.
Supply Voltage Ramping
Fast ramping of the supply voltage can cause a current
glitch in the internal ESD protection circuits. Depending on
the supply inductance, this could result in a supply volt-
age transient
that exceeds the maximum rating. A supply
voltage ramp time of greater than 1ms is recommended.
LTC5549
EN
5549 F09
7
V
CC
9
BIAS
LTC5549
X2
5549 F10
8
V
CC
9
LTC5549
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Typical applicaTion
Due to the wideband nature of the RF, LO and IF ports,
the LTC5549 may be used as an upmixer even when the
lower (IF) input frequency is applied to the RF port and
the higher (RF) output is taken from the IF port. Operation
Figure 11. An Upmixer Application with Input at the RF Port and Output at the IF Port
LTC5549
5.2GHz1.6GHz to 4.5GHz
3.6GHz to 0.7GHz
LO
RF IF
5549 F11a
INPUT FREQUENCY (GHz)
1.5 4.5
5549 F11b
12
14
8
2 2.5 3 3.5 4
30
24
26
28
22
16
18
20
10
CONVERSION LOSS (dB), IIP3 (dBm)
IIP3
CONVERSION LOSS
(a) Application Configuration
(b) Conversion Loss and IIP3 vs Input Frequency
(Low Side LO, Output = 5.2GHz)
in this manner only requires that the input and output
frequencies are within the specified frequency ranges.
One example is shown in Figure 11, where the RF input
ranges from 1.6GHz to 4.5GHz and the IF output is 5.2GHz.
LTC5549
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package DescripTion
UDB Package
Variation A
12-Lead Plastic QFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1985 Rev Ø)
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
BOTTOM VIEW—EXPOSED PAD
SIDE VIEW
0.75 ±0.05
R = 0.13
TYP
0.20 REF
(UDB12) DFN 0814 REV 0
0.60 ±0.10
0.15 REF
0.40 REF
0.40 ±0.10
0.40 ±0.10
1
3
46
7
9
10 12
0.50 ±0.10
0.50 ±0.10
3.00 ±0.10
0.77 ±0.10
DETAIL A
0.25 ±0.10
0.05 REF
2.00 ±0.10
DETAIL A
0.25 ±0.05
0.50 BSC
UDB Package
Variation: A
12-Lead Plastic QFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1985 Rev Ø)
0.00 – 0.05
0.77 ±0.05
DETAIL B
0.25 ±0.05
0.05 REF
0.25 ±0.05
0.75 ±0.05
3.50 ±0.05
0.65 ±0.05
2.50 ±0.05
PACKAGE
OUTLINE
0.50 BSC
DETAIL B
0.85 ±0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

LTC5549IUDB#TRMPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
RF Mixer 2GHz to 14GHz Microwave Mixer with Integrated LO Frequency Doubler
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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