SUD50N02-04P-E3

Vishay Siliconix
SUD50N02-04P
Document Number: 72216
S12-2053-Rev. C, 27-Aug-12
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
N-Channel 20 V (D-S) 175 °C MOSFET
FEATURES
TrenchFET
®
Power MOSFET
175 °C Junction Temperature
PWM Optimized for High Efficiency
Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
Synchronous Buck Converter
- Low-Side
- Desktop, Servers, Desknote
Synchronous Rectification
- POL
Notes:
a. Surface mounted on FR4 board, t 10 s.
b. Limited by package.
c. Single pulse.
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
()
I
D
(A)
a
20
0.0043 at V
GS
= 10 V
34
0.006 at V
GS
= 4.5 V
28
TO-252
SGD
Top View
Drain Connected to Tab
Ordering Information:
SUD50N02-04P-E3 (Lead (Pb)-free)
N-Channel MOSFET
G
D
S
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
20
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current
a
T
A
= 25 °C
I
D
34
a
A
T
C
= 25 °C
50
b
Pulsed Drain Current
I
DM
100
Continuous Source Current (Diode Conduction)
a
I
S
8.3
a
Avalanche Current
c
L = 0.1 mH
I
AS
50
Avalanche Energy
c
E
AS
125 mJ
Maximum Power Dissipation
T
A
= 25 °C
P
D
8.3
a
W
T
C
= 25 °C
136
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 175 °C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
a
t 10 s
R
thJA
15 18
°C/W
Steady State
40 50
Maximum Junction-to-Case
R
thJC
0.85 1.1
Vishay Siliconix
SUD50N02-04P
Document Number: 72216
S12-2053-Rev. C, 27-Aug-12
www.vishay.com
2
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
Notes:
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width 300 µs, duty cycle 2 %.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
Parameter Symbol Test Conditions Min. Typ.
a
Max. Unit
Static
Drain-Source Breakdown Voltage
V
(BR)DSS
V
GS
= 0 V, I
D
= 250 µA
20
V
Gate Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
0.8 3.0
Gate-Body Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 20 V, V
GS
= 0 V
1
µA
V
DS
= 20 V, V
GS
= 0 V, T
J
= 125 °C
50
On-State Drain Current
b
I
D(on)
V
DS
=5 V, V
GS
= 10 V
50 A
Drain-Source On-State Resistance
b
R
DS(on)
V
GS
= 10 V, I
D
= 20 A
0.0035 0.0043
V
GS
= 10 V, I
D
= 20 A, T
J
= 125 °C
0.0061
V
GS
= 4.5 V, I
D
= 20 A
0.0048 0.006
Forward Transconductance
b
g
fs
V
DS
= 15 V, I
D
= 20 A
15 S
Dynamic
a
Input Capacitance
C
iss
V
GS
= 0 V, V
DS
= 10 V, f = 1 MHz
5000
pFOutput Capacitance
C
oss
1650
Reverse Transfer Capacitance
C
rss
770
Gate Resistance
R
g
f = 1 MHz 1.6
Total Gate Charge
c
Q
g
V
DS
= 10 V, V
GS
= 4.5 V, I
D
= 50 A
40 60
nC
Gate-Source Charge
c
Q
gs
14
Gate-Drain Charge
c
Q
gd
13
Tur n - O n D e l ay Time
c
t
d(on)
V
DD
= 10 V, R
L
= 0.2
I
D
50 A, V
GEN
= 10 V, R
g
= 2.5
20 30
ns
Rise Time
c
t
r
20 30
Turn-Off Delay Time
c
t
d(off)
50 75
Fall Time
c
t
f
15 25
Source-Drain Diode Ratings and Characteristics T
C
= 25 °C
Pulsed Current
I
SM
100 A
Diode Forward Voltage
b
V
SD
I
F
= 50 A, V
GS
= 0 V
0.9 1.5 V
Source-Drain Reverse Recovery Time
t
rr
I
F
= 50 A, dI/dt = 100 A/µs
45 70 ns
Output Characteristics
0
40
80
120
160
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0
V
DS
- Drain-to-Source Voltage (V)
V
GS
= 10 thru 5 V
3 V
4 V
I
D
- Drain Current (A)
Transfer Characteristics
0
50
100
150
200
0123456
V
GS
- Gate-to-Source Voltage (V)
25 °C
T
C
= 125 °C
I
D
- Drain Current (A)
- 55 °C
Vishay Siliconix
SUD50N02-04P
Document Number: 72216
S12-2053-Rev. C, 27-Aug-12
www.vishay.com
3
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Transconductance
Capacitance
On-Resistance vs. Junction Temperature
0
40
80
120
160
0 15304560
T
C
= - 55 °C
I
D
- Drain Current (A)
T
C
= 25 °C
T
C
= 125 °C
G
FS
- Transconductance (S)
0
1000
2000
3000
4000
5000
6000
7000
0 5 10 15 20
V
DS
- Drain-to-Source Voltage (V)
C
- Capacitance (pF)
C
rss
C
iss
C
oss
0.6
0.8
1.0
1.2
1.4
1.6
1.8
- 50 - 25 0 25 50 75 100 125 150 175
T
J
- Junction Temperature (°C)
V
GS
= 10 V
I
D
= 20 A
R
DS(on)
- On-Resistance
(Normalized)
On-Resistance vs. Drain Current
Gate Charge
Source-Drain Diode Forward Voltage
0
2
4
6
8
10
0 20406080
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
V
DS
= 10 V
I
D
= 50 A
V
SD
- Source-to-Drain Voltage (V)
- Source Current (A)I
S
100
1
0.3 0.6 0.9 1.2 1.5
T
J
= 25 °CT
J
= 150 °C
0
10

SUD50N02-04P-E3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET RECOMMENDED ALT 781-SUD50N048M8P4GE3
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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