Data Sheet ADL5721
Rev. 0 | Page 11 of 15
APPLICATIONS INFORMATION
LAYOUT
Solder the exposed pad on the underside of the ADL5721 to a
low thermal and electrical impedance ground plane. This pad is
typically soldered to an exposed opening in the solder mask on
the evaluation board. Connect these ground vias to all other
ground layers on the evaluation board to maximize heat
dissipation from the device package.
Figure 23. Evaluation Board Layout for the ADL5721 Package
DIFFERENTIAL vs. SINGLE-ENDED OUTPUT
This section provides the test results that compare the ADL5721
using a differential vs. a single-ended output. When using the
device as a single-ended output, use the RFOP output of the
evaluation board and terminate RFON to 50 Ω. Note that the
converse can be done as well; however, doing so produces slightly
different results from the plots shown in this section, caused by
some amplitude imbalance between the two differential ports,
RFOP and RFON. The output trace and connector loss were not
deembedded for these measurements.
Note that this performance is typical and not guaranteed.
35
30
25
20
15
10
5
0
5.9 6.0 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 7.0 7.1 7.2
GAIN (dB)
FREQUENCY (GHz)
14258-024
Figure 24. Gain vs. Frequency, BAND = 0 V
0
35
30
25
20
15
10
5
7.1 7.2 7.3 7.4 7.5 7.6
7.7
7.8
7.9
8.0
8.1
8.2
8.3
8.4
8.5
GAIN (dB)
FREQUENCY (GHz)
14258-027
Figure 25. Gain vs. Frequency, BAND = 1.8 V
0
1
2
3
4
5
6
7
8
9
10
5.9
6.0 6.1
6.2
6.3 6.4 6.5 6.6
6.7
6.8
6.9 7.0 7.1 7.2
NOISE FIGURE (dB)
FREQUENCY (GHz)
14258-025
Figure 26. Noise Figure vs. Frequency, BAND = 0 V
0
1
2
3
4
5
6
7
8
9
10
7.1
7.2
7.3 7.4 7.5 7.6
7.7 7.8 7.9
8.0 8.1 8.2 8.3 8.4
8.5
NOSIE FIGURE (dB)
FREQUENCY (GHz)
14258-028
Figure 27. Noise Figure vs. Frequency, BAND = 1.8 V