Spec. No. JELF243B-0034C-01 P.3/9
MURATA MFG.CO., LTD.
7-2. Mechanical Performance
No. Item Specification Test Method
7-2-1 Appearance
and
Dimensions
Meet item 4. Visual Inspection and measured with Slide Calipers.
7-2-2 Bonding
Strength
Meet Table 1.
Table 1
It shall be soldered on the substrate.
Applying Force (F) : 6.8N
Applying Time : 5s±1s
Applied direction: Parallel to substrate
7-2-3 Bending
Strength
It shall be soldered on the substrate.
Subsatrate: Glass-epoxy 100mm40mm1.6mm
Deflection : 1.0mm
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
7-2-4 Vibration It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6h)
7-2-5 Resistance
to Soldering
Heat
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition for 48h±4h.
7-2-6 Drop Products shall be no failure
after tested.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 75cm
Attitude from which the product is dropped : 3 direction
The number of times : 3 times for each direction (Total 9 times)
7-2-7 Solderability The electrodes shall be at
least 95% covered with new
solder coating.
Flux : Ethanol solution of rosin, 25(wt)%
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
Appearance No damage
DC
Resistance
Meet item 3.
45mm
R340
F
Deflection
45mm
Product
Pressure jig
R0.5
Ｆ
Substrate
Ｆ
Side view
