SI4626ADY-T1-E3

Vishay Siliconix
Si4626ADY
New Product
Document Number: 69937
S09-0131-Rev. B, 02-Feb-09
www.vishay.com
1
N-Channel 30-V (D-S) MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Available
TrenchFET
®
Power MOSFET
100 % R
g
and UIS Tested
APPLICATIONS
Low-Side DC/DC Conversion
- Notebook
- Gaming
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)
I
D
(A)
a
Q
g
(Typ.)
30
0.0033 at V
GS
= 10 V
30
37 nC
0.0041 at V
GS
= 4.5 V
26.3
SO
-8
SD
SD
SD
GD
5
6
7
8
Top View
2
3
4
1
Ordering Information: Si4626ADY-T1-E3 (Lead (Pb)-free)
Si4626ADY-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
G
D
S
Notes:
a. Based on T
C
= 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under Steady State conditions is 85 °C/W.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
30
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
30
A
T
C
= 70 °C
22.6
T
A
= 25 °C
21.5
b, c
T
A
= 70 °C
17.1
b, c
Pulsed Drain Current
I
DM
70
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
5.4
T
A
= 25 °C
2.7
b, c
Single Pulse Avalanche Current
L = 0.1 mH
I
AS
40
Avalanche Energy
E
AS
80
mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
6.0
W
T
C
= 70 °C
3.3
T
A
= 25 °C
3.0
b, c
T
A
= 70 °C
1.9
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, d
t 10 s
R
thJA
33 42
°C/W
Maximum Junction-to-Foot (Drain) Steady State
R
thJF
16 21
www.vishay.com
2
Document Number: 69937
S09-0131-Rev. B, 02-Feb-09
Vishay Siliconix
Si4626ADY
New Product
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= 1 mA
30 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= 250 µA
37
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
- 7.3
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
1.2 2.5 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 30 V, V
GS
= 0 V
1
µA
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C
10
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= 10 V
30 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 10 V, I
D
= 15 A
0.0026 0.0033
Ω
V
GS
= 4.5 V, I
D
= 10 A
0.0032 0.0041
Forward Transconductance
a
g
fs
V
DS
= 15 V, I
D
= 15 A
85S
Dynamic
b
Input Capacitance
C
iss
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
5370
pFOutput Capacitance
C
oss
690
Reverse Transfer Capacitance
C
rss
330
Total Gate Charge
Q
g
V
DS
= 15 V, V
GS
= 10 V, I
D
= 10 A
82 125
nC
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 10 A
37 56
Gate-Source Charge
Q
gs
12.6
Gate-Drain Charge
Q
gd
9.8
Gate Resistance
R
g
f = 1 MHz 0.2 0.95 1.9 Ω
Tur n - On D e lay T i me
t
d(on)
V
DD
= 15 V, R
L
= 3 Ω
I
D
5 A, V
GEN
= 4.5 V, R
g
= 1 Ω
44 70
ns
Rise Time
t
r
21 35
Turn-Off Delay Time
t
d(off)
45 70
Fall Time
t
f
18 30
Tur n - On D e lay Ti m e
t
d(on)
V
DD
= 15 V, R
L
= 3 Ω
I
D
5 A, V
GEN
= 10 V, R
g
= 1 Ω
15 30
Rise Time
t
r
10 20
Turn-Off Delay Time
t
d(off)
43 70
Fall Time
t
f
8 15
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
5.4
A
Pulse Diode Forward Current
a
I
SM
70
Body Diode Voltage
V
SD
I
S
= 2.7 A
0.74 1.1 V
Body Diode Reverse Recovery Time
t
rr
I
F
= 5 A, dI/dt = 100 A/µs, T
J
= 25 °C
38 60 ns
Body Diode Reverse Recovery Charge
Q
rr
36 60 nC
Reverse Recovery Fall Time
t
a
20
ns
Reverse Recovery Rise Time
t
b
18
Document Number: 69937
S09-0131-Rev. B, 02-Feb-09
www.vishay.com
3
Vishay Siliconix
Si4626ADY
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
0
14
28
42
56
70
0.0 0.6 1.2 1.8 2.4 3.0
V
DS
- Drain-to-Source Voltage (V)
V
GS
=10thru 4 V
- Drain Current (A)I
D
3 V
0.0020
0.0025
0.0030
0.0035
0.0040
0.0045
0 1428425670
I
D
- Drain Current (A)
- On-Resistance (Ω)
R
DS(on)
V
GS
= 4.5 V
V
GS
=10V
0
2
4
6
8
10
0 102030405060708090
Q
g
- TotalGateCharge(nC)
I
D
=10A
- Gate-to-Source Voltage (V)
V
GS
V
DS
=10V
V
DS
=20V
V
DS
=15V
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
V
GS
- Gate-to-Source Voltage (V)
0.0
0.3
0.6
0.9
1.2
1.5
012345
T
C
= 25 °C
T
C
= - 55 °C
- Drain Current (A)I
D
T
C
=125 °C
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
C
rss
0
1100
2200
3300
4400
5500
6600
0 6 12 18 24 30
C
oss
C
iss
T
J
-Junction Temperature (°C)
0.7
0.9
1.1
1.3
1.5
1.7
- 50 - 25 0 25 50 75 100 125 150
I
D
=15A
R
DS(on)
-On-Resistance
(Normalized)
V
GS
=10V
V
GS
=4.5V

SI4626ADY-T1-E3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 30V 30A 6.0W 3.3mohm @ 10V
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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