OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

PLA192ES

P1-P3P4-P6P7-P7
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
4
R07
PLA192
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
PERFORMANCE DATA (@ 25ºC Unless Otherwise Noted)*
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
8
10
12
14
16
18
Typical AC/DC On-Resistance
vs. Temperature
(I
F
=5mA, I
L
=150mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
1
2
3
4
5
6
7
Typical DC-Only On-Resistance
vs. Temperature
(I
F
=5mA, I
L
=220mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
50
100
150
200
250
Maximum Load Current
vs. Temperature
(I
F
=5mA)
AC/DC Configuration
DC-Only Configuration
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Blocking Voltage (V
P
)
-40
770
760
750
740
730
720
710
700
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured across Pins 4&6
(V
L
=600V)
Temperature º(C)
Leakage (PA)
-40
0.06
0.05
0.04
0.03
0.02
0.01
0
-20 0 20 40 60 80 100
Load Voltage (V)
0.1 1 10 100 1000
Output Capacitance (pF)
0
20
40
60
80
100
120
140
160
180
Output Capacitance
vs. Load Voltage
(I
F
=0mA, f=1MHz)
Energy Rating Curve
(I
F
=5mA)
Time
Load Current (A)
10Ps
1.2
1.0
0.8
0.6
0.4
0.2
0
1ms100Ps 100ms
1s
10ms 10s 100s
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-Off Time (Ps)
200
250
300
350
400
450
500
Typical Turn-Off Time
vs. Temperature
(I
L
=100mA)
I
F
=10mA
I
F
=5mA
I
F
=2mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current to Operate (mA)
0.16
0.18
0.20
0.22
0.24
0.26
0.28
0.30
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=100mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (Ps)
500
1000
1500
2000
2500
3000
3500
4000
4500
Typical Turn-On Time
vs. Temperature
(I
L
=100mA)
I
F
=10mA
I
F
=2mA
I
F
=5mA
Voltage (V)
0123
Current (A)
-0.15
-0.10
-0.05
0.00
0.05
0.10
0.15
Typical Load Current vs. Load Voltage
AC/DC Configuration
(I
F
=5mA)
-3 -2 -1
Voltage (V)
0.0 0.2 0.4 0.6 0.8 1.0 1.2
Current (A)
0.00
0.05
0.10
0.15
0.20
0.25
Typical Load Current vs. Load Voltage
DC-Only Configuration
(I
F
=5mA)
I
NTEGRATED
C
IRCUITS
D
IVISION
PLA192
www.ixysic.com
5
R07
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
All Versions MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
All Versions 250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. IXYS Integrated Circuits Division employs the use of silicone coating as an optical
waveguide in the standard PLA192 (without the "E" suffix); the use of a short drying bake could be necessary if a
wash is used after solder reflow processes. The E-suffix product, being of double-molded construction, does not have
the same necessity for a drying bake. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning
methods that employ ultrasonic energy should not be used.
e
3
Pb
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
6
R07
PLA192
MECHANICAL DIMENSIONS
Dimensions
mm
(inches)
PCB Hole Pattern
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
0.254 ± 0.0127
(0.010 ± 0.0005)
9.144 ± 0.508
(0.360 ± 0.020)
7.239 TYP
(0.285 TYP)
7.620 ± 0.254
(0.300 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002)
4.064 TYP
(0.160 TYP)
0.457 ± 0.076
(0.018 ± 0.003)
8.382 ± 0.381
(0.330 ± 0.015)
2.54 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
0.254 ± 0.0127
(0.010 ± 0.0005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
8.382 ± 0.381
(0.330 ± 0.015)
2.54 ± 0.127
(0.100 ± 0.005)
9.524 ± 0.508
(0.375 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
PLA192 & PLA192E
PLA192S & PLA192ES
P1-P3P4-P6P7-P7

PLA192ES

Mfr. #:
Buy PLA192ES
Manufacturer:
Description:
Solid State Relays - PCB Mount SP Open Relay 6-Pin Surface Mount
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet