LT1638/LT1639
13
16389fg
SIMPLIF IED SCHEMATIC
TYPICAL APPLICATIONS
+
1/2 LT1638
5V
V
+
200Ω
200Ω
0.2Ω
2k
0V TO 4.3V
1638/39 F03
V
OUT
= (2Ω)(I
LOAD
)
Q1
2N3904
LOAD
I
LOAD
Figure 4. Current Source
Figure 3. Positive Supply Rail Current Sense
+
1/2 LT1638
R1
1.2V
R1
I
OUT
=
LT1634-1.2
I
OUT
1638/39 F04
V
CC
V
CC
The application in Figure 3 utilizes the Over-The-Top
capabilities of the LT1638. The 0.2Ω resistor senses the
load current while the op amp and NPN transistor form a
closed loop making the collector current of Q1
propor
tional to the load current. As a convenient monitor,
the 2k load resistor converts the current into a voltage. The
positive supply rail, V
+
, is not limited to the 5V supply of
the op amp and could be as high as 44V.
The Figure 4 application uses the LT1638 in conjunction
with the LT1634 micropower shunt reference. The supply
current of the op amp also biases the reference. The drop
across resistor R1 is fi xed at 1.2V generating an output
current equal to 1.2V/R1.
Q10
D5
Q9
Q1
Q7
R2
1k
R3
1k
R4
8k
Q8
Q5
–IN
+IN
Q11 Q12
D4
ONE AMPLIFIER
D2
Q2
D1
Q6
Q13 Q14
R1
6k
R5
8k
Q4
10μA
+
Q15
Q19
D3
Q3
Q16 Q18
Q22
V
+
Q17 Q20
Q21
OUT
V
1638/39 SS
LT1638/LT1639
14
16389fg
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
PACKAGE DESCRIPTION
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698 Rev C)
3.00 p0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.40 p 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 p 0.10
(2 SIDES)
0.75 p0.05
R = 0.125
TYP
2.38 p0.10
14
85
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 0509 REV C
0.25 p 0.05
2.38 p0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.65 p0.05
(2 SIDES)2.10 p0.05
0.50
BSC
0.70 p0.05
3.5 p0.05
PACKAGE
OUTLINE
0.25 p 0.05
0.50 BSC
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
MSOP (MS8) 0307 REV F
0.53 p 0.152
(.021 p .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016 p 0.0508
(.004 p .002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0o – 6o TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
12
3
4
4.90 p 0.152
(.193 p .006)
8
7
6
5
3.00 p 0.102
(.118 p .004)
(NOTE 3)
3.00 p 0.102
(.118 p .004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 p 0.127
(.035 p .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 p 0.038
(.0165 p .0015)
TYP
0.65
(.0256)
BSC
LT1638/LT1639
15
16389fg
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
PACKAGE DESCRIPTION
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
N8 Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
N8 1002
.065
(1.651)
TYP
.045 – .065
(1.143 – 1.651)
.130 ± .005
(3.302 ± 0.127)
.020
(0.508)
MIN
.018 ± .003
(0.457 ± 0.076)
.120
(3.048)
MIN
12
3
4
87 6
5
.255 ± .015*
(6.477 ± 0.381)
.400*
(10.160)
MAX
.008 – .015
(0.203 – 0.381)
.300 – .325
(7.620 – 8.255)
.325
+.035
–.015
+0.889
–0.381
8.255
()
NOTE:
1. DIMENSIONS ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
.100
(2.54)
BSC
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
s 45o
0o– 8o TYP
.008 – .010
(0.203 – 0.254)
SO8 0303
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
1
2
3
4
.150 – .157
(3.810 – 3.988)
NOTE 3
8
7
6
5
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.245
MIN
.160
p.005
RECOMMENDED SOLDER PAD LAYOUT
.045 p.005
.050 BSC
.030 p.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)

LT1639CS#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Precision Amplifiers Quad uP 1MHz R-to-R Op Amp
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union