Electrical Characteristics
MC9S08FL16 Series Data Sheet, Rev. 4
Freescale Semiconductor 19
5.8 External Oscillator (XOSC) and ICS Characteristics
Refer to Figure 11 for crystal or resonator circuits.
Table 9. XOSC and ICS Specifications (Temperature Range = –40 to 85 °C Ambient)
Num C Characteristic Symbol Min Typical
1
Max Unit
1C
Oscillator crystal or resonator (EREFS = 1, ERCLKEN = 1)
Low range (RANGE = 0)
High range (RANGE = 1) FEE or FBE mode
2
High range (RANGE = 1), high gain (HGO = 1), FBELP
mode
High range (RANGE = 1), low power (HGO = 0), FBELP
mode
f
lo
f
hi
f
hi
f
hi
32
1
1
1
38.4
5
16
8
kHz
MHz
MHz
MHz
2 D Load capacitors
C
1
C
2
See Note
3
3D
Feedback resistor
Low range (32 kHz to 38.4 kHz)
High range (1 MHz to 16 MHz)
R
F
10
1
MΩ
MΩ
4D
Series resistor — Low range
Low gain (HGO = 0)
High gain (HGO = 1)
R
S
0
100
kΩ
5D
Series resistor — High range
Low Gain (HGO = 0)
High Gain (HGO = 1)
8 MHz
4 MHz
1 MHz
R
S
0
0
0
0
10
20
kΩ
6C
Crystal startup time
4, 5
Low range, low power
Low range, high power
High range, low power
High range, high power
t
CSTL
t
CSTH
200
400
5
15
ms
7 T Internal reference start-up time
t
IRST
60 100 μs
8D
Square wave input clock frequency (EREFS = 0, ERCLKEN
= 1)
FEE or FBE mode
2
FBELP mode
f
extal
0.03125
0
5
20
MHz
MHz
9 P Average internal reference frequency — trimmed
f
int_t
31.25 kHz
10 P
DCO output frequency range — trimmed
6
Low range (DRS = 00)
f
dco_t
16 20 MHz
11 C
Total deviation of DCO output from trimmed frequency
4
Over full voltage and temperature range
Over fixed voltage and temperature range of 0 to 70°C
Δf
dco_t
–1.0 to 0.5
±0.5
± 2
± 1
%f
dco
12 C
FLL acquisition time
4,7
t
Acquire
1ms
MC9S08FL16 Series Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor20
Figure 10. Typical Crystal or Resonator Circuit
13 C
Long term jitter of DCO output clock (averaged over 2 ms
interval)
8
C
Jitter
0.02 0.2
%f
dco
1
Data in Typical column was characterized at 5.0 V, 25 °C or is typical recommended value.
2
When ICS is configured for FEE or FBE mode, input clock source must be divisible using RDIV to within the range of
31.25 kHz to 39.0625 kHz.
3
See crystal or resonator manufacturer’s recommendation.
4
This parameter is characterized and not tested on each device.
5
Proper PC board layout procedures must be followed to achieve specifications.
6
The resulting bus clock frequency should not exceed the maximum specified bus clock frequency of the device.
7
This specification applies to any time the FLL reference source or reference divider is changed, trim value changed, DMX32
bit is changed, DRS bit is changed, or changing from FLL disabled (FBELP, FBILP) to FLL enabled (FEI, FEE, FBE, FBI). If
a crystal/resonator is being used as the reference, this specification assumes it is already running.
8
Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum f
Bus
.
Measurements are made with the device powered by filtered supplies and clocked by a stable external clock signal. Noise
injected into the FLL circuitry via V
DD
and V
SS
and variation in crystal oscillator frequency increase the C
Jitter
percentage for
a given interval.
Table 9. XOSC and ICS Specifications (Temperature Range = –40 to 85 °C Ambient) (continued)
Num C Characteristic Symbol Min Typical
1
Max Unit
XOSC
EXTAL XTAL
Crystal or Resonator
R
S
C
2
R
F
C
1
Electrical Characteristics
MC9S08FL16 Series Data Sheet, Rev. 4
Freescale Semiconductor 21
Figure 11. Deviation of DCO Output from Trimmed Frequency (20 MHz, 5.0 V)
5.9 AC Characteristics
This section describes timing characteristics for each peripheral system.
-2.00%
-1.50%
-1.00%
-0.50%
0.00%
0.50%
1.00%
-60 -40 -20 0 20 40 60 80 100 120
Temperature
Deviation (%)

MC9S08FL8CBM

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
8-bit Microcontrollers - MCU S08 8K FLASH FL8
Lifecycle:
New from this manufacturer.
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