3
LT6300
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
ELECTRICAL CHARACTERISTICS
The ● denotes the specifications which apply over the full specified temperature range, otherwise specifications are at T
A
= 25°C.
V
CM
= 0V, pulse tested, ±5V ≤ V
S
≤ ±12V, V
SHDNREF
= 0V, R
BIAS
= 24.9k between V
+
and SHDN unless otherwise noted. (Note 3)
A
VOL
Large-Signal Voltage Gain V
S
= ±12V, V
OUT
= ±10V, R
L
= 40Ω 63 76 dB
● 57 dB
V
S
= ±5V, V
OUT
= ±3V, R
L
= 25Ω 60 70 dB
● 54 dB
V
OUT
Output Swing V
S
= ±12V, R
L
= 100Ω 10.7 10.9 ±V
● 10.5 ±V
V
S
= ±12V, I
L
= 250mA 10.4 10.7 ±V
● 10.2 ±V
V
S
= ±5V, R
L
= 25Ω 3.5 3.8 ±V
● 3.3 ±V
V
S
= ±5V, I
L
= 250mA 3.4 3.7 ±V
● 3.2 ±V
I
OUT
Maximum Output Current V
S
= ±12V, R
L
= 1Ω 500 1200 mA
I
S
Supply Current per Amplifier V
S
= ±12V, R
BIAS
= 24.9k (Note 6) 8.0 10 13.5 mA
● 6.7 15.0 mA
V
S
= ±12V, R
BIAS
= 32.4k (Note 6) 8 mA
V
S
= ±12V, R
BIAS
= 43.2k (Note 6) 6 mA
V
S
= ±12V, R
BIAS
= 66.5k (Note 6) 4 mA
V
S
= ±5V, R
BIAS
= 24.9k (Note 6) 2.2 3.4 5.0 mA
● 1.8 5.8 mA
Supply Current in Shutdown V
SHDN
= 0.4V 0.1 1 mA
Output Leakage in Shutdown V
SHDN
= 0.4V 0.3 1 mA
Channel Separation V
S
= ±12V, V
OUT
= ±10V, R
L
= 40Ω 80 110 dB
● 77 dB
SR Slew Rate V
S
= ±12V, A
V
= –10, (Note 7) 300 600 V/µs
V
S
= ±5V, A
V
= –10, (Note 7) 100 200 V/µs
HD2 Differential 2nd Harmonic Distortion V
S
= ±12V, A
V
= 10, 2V
P-P
, R
L
= 50Ω, 1MHz –85 dBc
HD3 Differential 3rd Harmonic Distortion V
S
= ±12V, A
V
= 10, 2V
P-P
, R
L
= 50Ω, 1MHz –82 dBc
GBW Gain Bandwidth f = 1MHz 200 MHz
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 2: Applies to short circuits to ground only. A short circuit between
the output and either supply may permanently damage the part when
operated on supplies greater than ±10V.
Note 3: The LT6300C is guaranteed to meet specified performance from
0°C to 70°C and is designed, characterized and expected to meet these
extended temperature limits, but is not tested at –40°C and 85°C. The
LT6300I is guaranteed to meet the extended temperature limits.
Note 4: Thermal resistance varies depending upon the amount of PC board
metal attached to Pins 1, 8, 9, 16 of the device. If the maximum
dissipation of the package is exceeded, the device will go into thermal
shutdown and be protected.
Note 5: Guaranteed by the CMRR tests.
Note 6: R
BIAS
is connected between V
+
and the SHDN pin, with the
SHDNREF pin grounded.
Note 7: Slew rate is measured at ±5V on a ±10V output signal while
operating on ±12V supplies and ±1V on a ±3V output signal while
operating on ±5V supplies.