RHYTHM R3110
www.onsemi.com
14
Package Dimensions
SIP21, 3.10x5.08
CASE 127DF
ISSUE O
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
4. DIMENSIONS b, L, AND L1 ARE MEASURED AT
THE SURFACE OF THE PACKAGE BODY.
DIM
A
MIN MAX
−−−
MILLIMETERS
A1
b 0.470 0.546
e 0.686 BSC
1.14
E
D
A
B
PIN A1
INDICATOR
21X
b
4
B
C
A1
C
0.07 0.17
A1
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
TOP VIEW
SIDE VIEW
BOTTOM VIEW
A2 0.889 REF
RECOMMENDED
PACKAGE
OUTLINE
123
A
e1
e1 1.029 BSC
e2 0.965 BSC
A
e
e2
D
E
0.10 C
0.10 C
2X
2X
0.05 C
0.13 C
NOTE 3
A0.05 C
NOTE 4
B
0.03
C
5.080 BSC
3.100 BSC
0.70
0.56
0.686
2.94
L 0.546 0.622
L1 0.673 0.749
A2
567
17X
L
4X
L1
PITCH
21X
0.94
4X
7X
0.81
10X
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