NCP1397A/B, NCV1397A/B
www.onsemi.com
27
PACKAGE DIMENSIONS
SOIC−16 NB, LESS PIN 13
CASE 751AM
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL BE
0.13 TOTAL IN EXCESS OF THE b DIMENSION AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
18
16 9
SEATING
PLANE
L
M
h
x 45
_
e
15X
H
E
D
M
0.25 B
M
A1
A
DIM MIN MAX
MILLIMETERS
D 9.80 10.00
E 3.80 4.00
A 1.35 1.75
b 0.35 0.49
L 0.40 1.25
e 1.27 BSC
C 0.19 0.25
A1 0.10 0.25
M 0 7
H 5.80 6.20
h 0.25 0.50
__
6.40
15X
0.58
15X
1.12
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
16
89
M
0.25 A
S
b 15X
T
B
S
A B
C
C
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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