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CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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HIP2100
100V/2A Peak, Low Cost, High Frequency
Half Bridge Driver
The HIP2100 is a high frequency, 100V Half Bridge
N-Channel power MOSFET driver IC. The low-side and
high-side gate drivers are independently controlled and
matched to 8ns. This gives the user maximum flexibility in
dead-time selection and driver protocol. Undervoltage
protection on both the low-side and high-side supplies force
the outputs low. An on-chip diode eliminates the discrete
diode required with other driver ICs. A new level-shifter
topology yields the low-power benefits of pulsed operation
with the safety of DC operation. Unlike some competitors,
the high-side output returns to its correct state after a
momentary undervoltage of the high-side supply.
Applications
• Telecom Half Bridge Power Supplies
• Avionics DC/DC Converters
• Two-Switch Forward Converters
• Active Clamp Forward Converters
Features
• Drives N-Channel MOSFET Half Bridge
• SOIC, EPSOIC, QFN and DFN Package Options
• SOIC, EPSOIC and DFN Packages Compliant with 100V
Conductor Spacing Guidelines of IPC-2221
• Pb-Free Product Available (RoHS Compliant)
• Bootstrap Supply Max Voltage to 114VDC
• On-Chip 1 Bootstrap Diode
• Fast Propagation Times for Multi-MHz Circuits
• Drives 1000pF Load with Rise and Fall Times Typ. 10ns
• CMOS Input Thresholds for Improved Noise Immunity
• Independent Inputs for Non-Half Bridge Topologies
• No Start-Up Problems
• Outputs Unaffected by Supply Glitches, HS Ringing Below
Ground, or HS Slewing at High dv/dt
• Low Power Consumption
• Wide Supply Range
• Supply Undervoltage Protection
•3 Driver Output Resistance
• QFN/DFN Package:
- Compliant to JEDEC PUB95 MO-220
QFN - Quad Flat No Leads - Package Outline
- Near Chip Scale Package Footprint, which Improves
PCB Efficiency and has a Thinner Profile
-
Ordering Information
PART NUMBER
(Note 1)
PART
MARKING
TEMP. RANGE
(°C) PACKAGE
PKG.
DWG. #
HIP2100IB (No longer available,
recommended replacements: HIP2100IBZ, HIP2100IBZT)
2100 IB -40 to +125 8 Ld SOIC M8.15
HIP2100IBZ (Note 2) 2100 IBZ -40 to +125 8 Ld SOIC (Pb-free) M8.15
HIP2100EIBZ (Note 2) 2100 EIBZ -40 to +125 8 Ld EPSOIC (Pb-free) M8.15C
HIP2100IRZ (Note 2) HIP 2100IRZ -40 to +125 16 Ld 5x5 QFN (Pb-free) L16.5x5
HIP2100IR4Z (Note 2) (No longer available,
recommended replacements: HIP2100IRZ, HIP2100IRZT)
21 00IR4Z -40 to +125 12 Ld 4x4 DFN (Pb-free) L12.4x4A
NOTES:
1. Add “T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
Data Sheet August 31, 2015 FN4022.15
