2
The optical sub-assemblies utilize a high-volume
assembly process together with low-cost lens elements
which result in a cost-eective building block.
The electrical subassembly consists of a high-volume
multi-layer printed circuit board on which the IC circuits
and various surface-mount passive circuit elements are
attached.
The outer housing, including the SBCON-compliant
duplex connector receptacle, is molded of lled, non-con-
ductive UL 94V-0 ame retardant Ultem® plastic (U.L. File
E121562) to provide mechanical strength and electrical
isolation.
The transceiver is attached to a printed circuit board with
28 signal pins (4 rows of 7 pins) and with the four slots on
the anges which are located on the package sides. These
four slots on the anges provide the primary mechanical
strength to withstand the loads imposed by the duplex
connectored ber cables.
Applications Information
The Applications Engineering group in the Avago Optical
Communications Division is available to assist you with
the technical understanding associated with this trans-
ceiver. You can contact them through your local Avago
sales representative.
Avago LED technology has produced 1300 nm LED
devices with lower aging characteristics than normally
associated with these technologies in the industry. The
industry convention is 1.5 dB aging for 1300 nm LEDs.
The Avago LED will normally experience less than half this
amount of aging over normal, commercial equipment
mission-life periods. Contact your local Avago sales rep-
resentatives for additional details.
Recommended Handling Precautions
It is advised that normal, anti-static precautions be taken
in the handling and assembly of these transceivers to
prevent damage which may be induced by electrostatic
discharge (ESD). The HFBR-5320Z transceiver meets Mil-
Std-883C Method 3015.4 Class 2.
Care should be used to avoid shorting the receiver Data
or Status Flag Outputs directly to ground without proper
current limiting impedance.
Solder and Wash Process Compatibility
The transceiver is delivered with a protective process plug
inserted into the duplex SBCON connector receptacle.
This process plug protects the optical sub-assemblies
during wave solder and aqueous wash processing and
acts as a dust cover during shipping. These transceivers
are compatible with either industry standard wave or
hand soldering processes. The process plug part number
is HFBR-5002.
Shipping Container
The transceiver is packaged in a shipping container
designed to protect it from mechanical and ESD damage
during shipment or storage.
Board Layout - Decoupling Circuit and Ground Planes
It is important to take care in the layout of your circuit
board to achieve optimum performance from the trans-
ceiver. Figure 3 provides a good example of a schematic
for a power supply decoupling circuit that works well
with this part. It is further recommended that a con-
tiguous ground plane be provided in the circuit board
directly under the transceiver to provide a low inductive
ground for signal return current. This recommendation
is in keeping with good high-frequency board layout
practices.
Figure 1. Block diagram.
Note:
Ultem is a registered trademark of General Electric Corporation.
DATA OUT
SIGNAL
DETECT OUT
DATA IN
ELECTRICAL SUBASSEMBLY
QUANTIZER IC
DRIVER IC
TOP VIEW
PIN
PHOTODIODE
DUPLEX
RECEPTACLE
OPTICAL
SUBASSEMBLIES
LED
PREAMP
IC
DIFFERENTIAL
DIFFERENTIAL
DIFFERENTIAL