MC10H642, MC100H642
http://onsemi.com
4
Table 5. 10H/100H TTL DC CHARACTERISTICS (V
T
= V
E
= 5.0 V ±5%)
Symbol Characteristic Condition
T
A
= 0°C T
A
= 25°C T
A
= 85°C
Unit
Min Max Min Max Min Max
V
IH
V
IL
Input HIGH Voltage
Input LOW Voltage
2.0
0.8
2.0
0.8
2.0
0.8
V
I
IH
Input HIGH Current V
IN
= 2.7 V
V
IN
= 7.0 V
20
100
20
100
20
100
mA
I
IL
Input LOW Current V
IN
= 0.5 V −0.6 −0.6 −0.6 mA
V
OH
Output HIGH Voltage I
OH
= −3.0 mA
I
OH
= −15 mA
2.5
2.0
2.5
2.0
2.5
2.0
V
V
OL
Output LOW Voltage I
OL
= 24 mA 0.5 0.5 0.5 V
V
IK
Input Clamp Voltage I
IN
= −18 mA −1.2 −1.2 −1.2 V
I
OS
Output Short Circuit Current V
OUT
= 0 V −100 −225 −100 −225 −100 −225 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Table 6. AC CHARACTERISTICS (V
T
= V
E
= 5.0 V ±5%)
T
A
= 0°C T
A
= 25°C T
A
= 85°C
Symbol Characteristic Condition Min Max Min Max Min Max Unit
t
PLH
Propagation Delay
D to Output
Q2−Q7
C ECL
C TTL
CL = 25 pF
4.70
4.70
5.70
5.70
4.75
4.75
5.75
5.75
4.60
4.50
5.60
5.50
ns
tskpp Part−to−Part Skew 1.0 1.0 1.0 ns
tskwd* Within−Device Skew 0.5 0.5 0.5 ns
t
PLH
Propagation Delay
D to Output
Q0, Q1
C ECL
C TTL
CL = 25 pF
4.30
4.30
5.30
5.30
4.50
4.50
5.50
5.50
4.25
4.25
5.25
5.25
ns
tskpp Part−to−Part Skew All
Outputs
CL = 25 pF 2.0 2.0 2.0 ns
tskwd Within−Device Skew CL = 25 pF 1.0 1.0 1.0 ns
t
PD
Propagation Delay
R to Output
All
Outputs
CL = 25 pF 4.3 6.3 4.0 6.0 4.5 6.5 ns
t
R
t
F
Output Rise/Fall Time
0.8 V to 2.0 V
All
Outputs
CL = 25 pF 2.5
2.5
2.5
2.5
2.5
2.5
ns
f
MAX
** Maximum Input Frequency CL = 25 pF 100 100 100 MHz
RPW Reset Pulse Width 1.5 1.5 1.5 ns
RRT Reset Recovery Time 1.25 1.25 1.25 ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
* Within−Device Skew defined as identical transactions on similar paths through a device.
**MAX Frequency is 135 MHz.
