Characteristics STPS340-Y
4/8 Doc ID 17390 Rev 1
Figure 7. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
Figure 8. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMC)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z/R
th(j-a) th(j-a)
T
δ
=tp/T
tp
t (s)
p
Single pulse
SMB
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z/R
th(j-a) th(j-a)
T
δ
=tp/T
tp
t (s)
p
Single pulse
SMC
Figure 9. Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 10. Junction capacitance versus
reverse voltage applied
(typical values)
I (mA)
R
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
0 5 10 15 20 25 30 35 40
T
j
=150°C
T
j
=125°C
T
j
=100°C
T
j
=75°C
T
j
=25°C
V (V)
R
10
100
1000
1 10 100
C(pF)
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
Figure 11. Forward voltage drop versus
forward current
Figure 12. Thermal resistance junction to
ambient versus copper surface
under each lead
I (A)
FM
0.01
0.10
1.00
10.00
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
T
j
=25°C
(Maximum values)
T
j
=125°C
(Typical values)
T
j
=125°C
(Typical values)
T
j
=125°C
(Maximum values)
V (V)
FM
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMB / SMC
S (cm²)
CU
R (°C/W)
th(j-a)
Printed circuit board FR4
copper thickness = 35 µm
