Spec No.JELF243A-0100F-01 P.13/15
MURATA MFG.CO.,LTD
Reference Only
11.6 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.
(3) Cleaner
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning Please contact us.
11.7 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin,
or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine
by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted
on your board.
11.8 Caution for use
Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched
to the winding portion to prevent the
breaking of wire.
Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
11.9 Notice of product handling at mounting
In some mounting machines,when picking up components support pin pushes up the components from the
bottom of base tape. In this case, please remove the support pin. The support pin may damage the
components and break wire.
In rare case ,the laser recognition can not recognize this component. Please contact us when you use laser
recognition. (There is no problem with the permeation and reflection type.)
Spec No.JELF243A-0100F-01 P.14/15
MURATA MFG.CO.,LTD
Reference Only
11.10Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
11.11 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature -10°C to 40°C
Humidity
15% to 85% relative humidity No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause
oxidization of electrode, resulting in poor solderability.
Products should not be stored on bulk packaging condition to prevent the chipping of the
core and the breaking of winding wire caused by the collision between the products.
Products should be stored on the palette for the prevention of the influence from humidity,
dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and
so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or
mechanical shock.
12
! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
Spec No.JELF243A-0100F-01 P.15/15
MURATA MFG.CO.,LTD
Reference Only
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
V
1
A B V
2
I
1
C D I
2
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
V
1
V
2
I
1
I
2
(3) Thus,the relation between Zx and Zm is following;
Zm-β where, α= D / A =1
1-ZmΓ β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zsm:measured impedance of short chip
Zss:residual impedance of short chip (0.556nH)
Yom:measured admittance when opening the fixture
(4) Lx and Qx shall be calculated with the following equation.
Im(Zx) Im(Zx)
Lx :Inductance of chip coil
2πf Re(Zx) Qx:Q of chip coil
f :Measuring frequency
=
Zm=
Zx=
Zx=α
Lx=
Qx=
<Electrical Performance:Measuring Method of Inductance/Q>
A
B
C
D
Zm
Zx
V
1
2
1
2
ProductTest fixtureTest Head
I
I
V

LQW15AN36NG80D

Mfr. #:
Manufacturer:
Murata Electronics
Description:
Fixed Inductors 0402 36nH 540mA +/-2%
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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