AOTF11N60L

AOT11N60/AOTF11N60
600V,11A N-Channel MOSFET
General Description Product Summary
V
DS
I
D
(at V
GS
=10V) 11A
R
DS(ON)
(at V
GS
=10V) < 0.65
100% UIS Tested
100% R
g
Tested
For Halogen Free add "L" suffix to part number:
AOT11N60L & AOTF11N60L
Symbol
V
DS
The AOT11N60 & AOTF11N60 have been
fabricated using an advanced high voltage MOSFET
process that is designed to deliver high levels of
performance and robustness in popular AC-DC
applications.By providing low R
DS(on)
, C
iss
and C
rss
along with guaranteed avalanche capability these
parts can be adopted quickly into new and existing
offline power supply designs.
V
UnitsParameter
Absolute Maximum Ratings T
A
=25°C unless otherwise noted
700V@150
Drain-Source Voltage
AOT11N60 AOTF11N60 AOTF11N60L
600
G
D
S
Top View
AOTF11N60
TO-220FTO-220
AOT11N60
G
D
S
G
D
S
V
GS
I
DM
I
AR
E
AR
E
AS
Peak diode recovery dv/dt dv/dt
T
J
, T
STG
T
L
Symbol
R
JA
R
θCS
R
θJC
* Drain current limited by maximum junction temperature.
-55 to 150
300
±30
4.8
39
345
690
11*
8*
Maximum Case-to-sink
A
Maximum Junction-to-Case
°C/W
°C/W
Derate above 25
o
C
Parameter
2.2 0.4
W/
o
C
Junction and Storage Temperature Range
Maximum Junction-to-Ambient
A,D
Power Dissipation
B
P
D
T
C
=25°C
Thermal Characteristics
37.9
VGate-Source Voltage
T
C
=100°C
A
Pulsed Drain Current
C
Continuous Drain
Current
T
C
=25°C
I
D
11 11*
8
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds
°C
°C
W
8*
mJ
V/ns
A
mJ
272 50
Avalanche Current
C
Single plused avalanche energy
G
Repetitive avalanche energy
C
5
0.3
0.46
--
Units
°C/W65
0.5
65
2.5
AOT11N60 AOTF11N60
65
--
3.3
AOTF11N60L
Rev 0: Jan 2012
www.aosmd.com Page 1 of 6
AOT11N60/AOTF11N60
Symbol Min Typ Max Units
600
700
BV
DSS
/∆TJ
0.67
V/
o
C
1
10
I
GSS
Gate-Body leakage current
±100
nΑ
V
GS(th)
Gate Threshold Voltage
3.3 3.9 4.5 V
R
DS(ON)
0.56 0.65
g
FS
12 S
V
SD
0.73 1 V
I
S
Maximum Body-Diode Continuous Current 11 A
I
SM
39 A
C
iss
1320 1656 1990 pF
C
oss
100 146 195 pF
C
rss
6.5 11.2 16 pF
R
g
1.7 3.5 5.3
Q
g
24 30.6 37 nC
Q
gs
9.6 nC
Q
gd
9.6 nC
t
D(on)
39 ns
t
r
58 ns
t
D(off)
92
ns
V
GS
=0V, V
DS
=25V, f=1MHz
SWITCHING PARAMETERS
I
S
=1A,V
GS
=0V
V
DS
=40V, I
D
=5.5A
Forward Transconductance
Diode Forward Voltage
Electrical Characteristics (T
J
=25°C unless otherwise noted)
STATIC PARAMETERS
Parameter Conditions
V
DS
=5V
I
D
=250µA
V
DS
=480V, T
J
=125°C
Breakdown Voltage Temperature
Coefficient
I
DSS
Zero Gate Voltage Drain Current
V
DS
=600V, V
GS
=0V
BV
DSS
I
D
=250µA, V
GS
=0V
µA
V
DS
=0V, V
GS
=±30V
V
Drain-Source Breakdown Voltage
Maximum Body-Diode Pulsed Current
Input Capacitance
Output Capacitance
Turn-On DelayTime
DYNAMIC PARAMETERS
Turn-Off DelayTime
V
GS
=10V, V
DS
=300V, I
D
=11A,
R
G
=25
Gate resistance
V
GS
=0V, V
DS
=0V, f=1MHz
Turn-On Rise Time
Reverse Transfer Capacitance
I
D
=250µA, V
GS
=0V, T
J
=25°C
I
D
=250µA, V
GS
=0V, T
J
=150°C
Gate Drain Charge
Total Gate Charge
V
GS
=10V, V
DS
=480V, I
D
=11A
Gate Source Charge
Static Drain-Source On-Resistance
V
GS
=10V, I
D
=5.5A
t
D(off)
92
ns
t
f
42 ns
t
rr
400
500
600
ns
Q
rr
4.7
5.9
7.1
µC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
I
F
=11A,dI/dt=100A/µs,V
DS
=100V
Body Diode Reverse Recovery Charge
I
F
=11A,dI/dt=100A/µs,V
DS
=100V
Turn-Off DelayTime
R
G
=25
Turn-Off Fall Time
Body Diode Reverse Recovery Time
A. The value of R
θJA
is measured with the device in a still air environment with T
A
=25°C.
B. The power dissipation P
D
is based on T
J(MAX)
=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature T
J(MAX)
=150°C, Ratings are based on low frequency and duty cycles to keep initial
T
J
=25°C.
D. The R
θJA
is the sum of the thermal impedence from junction to case R
θJC
and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of T
J(MAX)
=150°C. The SOA curve provides a single pulse rating.
G. L=60mH, I
AS
=4.8A, V
DD
=150V, R
G
=25, Starting T
J
=25°C
Rev0: Jan 2012 www.aosmd.com Page 2 of 6
AOT11N60/AOTF11N60
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
0
4
8
12
16
20
0 5 10 15 20 25 30
I
D
(A)
V
DS
(Volts)
Fig 1: On-Region Characteristics
V
GS
=5.5V
6V
10V
6.5V
0.1
1
10
100
2 4 6 8 10
I
D
(A)
V
GS
(Volts)
Figure 2: Transfer Characteristics
-
55
°
C
V
DS
=40V
25°C
125
°
C
0.4
0.6
0.8
1.0
1.2
1.4
0 4 8 12 16 20 24
R
DS(ON)
(
)
I
D
(A)
Figure 3: On
-
Resistance vs. Drain Current and Gate
V
GS
=10V
0
0.5
1
1.5
2
2.5
3
-100 -50 0 50 100 150 200
Normalized On-Resistance
Temperature (°C)
Figure 4: On
-
Resistance vs. Junction Temperature
V
GS
=10V
I
D
=5.5A
40
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.2 0.4 0.6 0.8 1.0
I
S
(A)
V
SD
(Volts)
Figure 6: Body-Diode Characteristics (Note E)
25°C
125°C
Figure 3: On
-
Resistance vs. Drain Current and Gate
Voltage
Figure 4: On
-
Resistance vs. Junction Temperature
0.8
0.9
1
1.1
1.2
-100 -50 0 50 100 150 200
BV
DSS
(Normalized)
T
J
(°C)
Figure 5:Break Down vs. Junction Temperature
Rev0: Jan 2012 www.aosmd.com Page 3 of 6

AOTF11N60L

Mfr. #:
Manufacturer:
Description:
MOSFET N-CH 600V 11A TO220F
Lifecycle:
New from this manufacturer.
Delivery:
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