LTM8040
18
8040fa
PACKAGE DESCRIPTION
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. THE TOTAL NUMBER OF PADS: 66
4
3
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR A
MARKED FEATURE
SYMBOL
aaa
bbb
eee
TOLERANCE
0.15
0.10
0.05
9.000
BSC
PACKAGE TOP VIEW
LGA 66 0407 REV A
15.000
BSC
4
PAD 1
CORNER
3
PADS
SEE NOTES
X
Y
aaa Z
aaa Z
1.270
BSC
0.605 – 0.665
0.605 – 0.665
12.700
BSC
7.620
BSC
PAD 1
C (0.30)
HBADC
6
7
5
1
2
3
4
EF
PACKAGE BOTTOM VIEW
PACKAGE IN TRAY LOADING ORIENTATION
GLJK
2.540
2.540
1.270
5.080
5.080
6.350
6.350
3.810
3.810
0.000
1.270
3.810
3.810
2.540
2.540
1.270
1.270
0.000
1.5875
0.9525
SUGGESTED PCB LAYOUT
TOP VIEW
LTMXXXXXX
μModule
TRAY PIN 1
BEVEL
COMPONENT
PIN 1
0.9525
1.5875
4.22 – 4.42
DETAIL B
DETAIL B
SUBSTRATE
MOLD
CAP
0.27 – 0.37
3.95 – 4.05
Z
DETAIL A
DETAIL A
0.635 p0.025 SQ. 66x
S
YXeee
bbb Z
LGA Package
66-Lead (15mm × 9mm × 4.32mm)
(Reference LTC DWG # 05-08-1810 Rev A)
